Datasheet
Table Of Contents
- FEATURES
- APPLICATIONS
- DESCRIPTION
- ABSOLUTE MAXIMUM RATINGS
- THERMAL INFORMATION
- ELECTRICAL CHARACTERISTICS: ADS7947 (12-Bit)
- ELECTRICAL CHARACTERISTICS: ADS7948 (10-Bit)
- ELECTRICAL CHARACTERISTICS: ADS7949 (8-Bit)
- TIMING DIAGRAM
- TIMING REQUIREMENTS
- PIN CONFIGURATION
- TYPICAL CHARACTERISTICS: ADS7947, ADS7948, ADS7949
- TYPICAL CHARACTERISTICS: ADS7947 (12-Bit)
- OVERVIEW
- DEVICE OPERATION
- APPLICATION INFORMATION
ADS7947
ADS7948
ADS7949
SLAS708 –SEPTEMBER 2010
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
FAMILY AND ORDERING INFORMATION
(1)
PRODUCT RESOLUTION (Bits) INPUT SAMPLE RATE (MSPS)
ADS7947 12 Unipolar, pseudo-differential 2
ADS7948 10 Unipolar, pseudo-differential 2
ADS7949 8 Unipolar, pseudo-differential 2
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range, unless otherwise noted.
ADS7947, ADS7948, ADS7949
MIN MAX UNIT
AINxP to GND or AINxN to GND –0.3 AVDD + 0.3 V
AVDD to GND or DVDD to GND –0.3 +7 V
Digital input voltage to GND –0.3 DVDD + 0.3 V
Digital output to GND –0.3 DVDD + 0.3 V
Operating temperature range –40 +125 °C
Storage temperature range –65 +150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under electrical characteristics is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
ADS7947/48/49
THERMAL METRIC
(1)
RTE UNITS
16 PINS
q
JA
Junction-to-ambient thermal resistance 54.3
q
JCtop
Junction-to-case (top) thermal resistance 53.7
q
JB
Junction-to-board thermal resistance 19.2
°C/W
y
JT
Junction-to-top characterization parameter 0.3
y
JB
Junction-to-board characterization parameter 14.5
q
JCbot
Junction-to-case (bottom) thermal resistance 5.2
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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Product Folder Link(s): ADS7947 ADS7948 ADS7949