Datasheet

ADS7924
SBAS482A –JANUARY 2010–REVISED MAY 2010 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this
document, or visit the device product folder at ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range, unless otherwise noted.
ADS7924 UNIT
Supply voltage, AVDD to AGND –0.3 to +6 V
Supply voltage, DVDD to DGND –0.3 to +6 V
Supply voltage, DVDD to AVDD AVDD ≥ DVDD V
AGND to DGND –0.3 to +0.3 V
Analog input voltage AGND – 0.3 to AVDD + 0.3 V
Digital input voltage with respect to DGND (SCL and SDA) DGND – 0.3 to 6 V
Digital input voltage with respect to DGND (A0, RESET) DGND – 0.3 to DVDD + 0.3 V
Input current to all pins except supply pins –10 to +10 mA
Maximum operating temperature +125 °C
Storage temperature range –60 to +150 °C
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
THERMAL INFORMATION
ADS7924
THERMAL METRIC
(1)
RTE UNITS
16
q
JA
Junction-to-ambient thermal resistance 48.1
q
JC(top)
Junction-to-case(top) thermal resistance 47.3
q
JB
Junction-to-board thermal resistance 60.8
°C/W
y
JT
Junction-to-top characterization parameter 0.3
y
JB
Junction-to-board characterization parameter 14.1
q
JC(bottom)
Junction-to-case(bottom) thermal resistance 0.4
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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