Datasheet


SLAS400B − SEPTEMBER 2003 − REVISED NOVEMBER 2005
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6
PIN ASSIGNMENTS
1
2
3
4
5
6
7
8
9
10
11
12
13
14 15 16 17 18 19 20 21 22 23 24
36
35
34
33
32
31
30
29
28
27
26
25
373839404142434445464748
BUSY
BDGND
+VBD
NC
NC
NC
NC
DB0
DB1
DB2
DB3
BDGND
+VBD
DB4 DB5 DB6 DB7 DB8 DB9
DB10
DB11
AGND AGND
+VA
REFIN
REFOUT
NC
+VA
AGND
+IN
−IN
AGND
+VA
+VA
AGND
AGND
REFM REFM +VA AGND AGND +VA CS RD CONVST BYTE PWD/RST A_PWD
NC − No connection
PFB PACKAGE
(TOP VIEW)
A_PWD
PWD/RST
BYTE
CONVST
RD
CS
+VA
AGND
AGND
+VA
REFM
REFM
RGZ PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
12
36
35
34
33
32
31
30
29
28
27
26
25
48 47 46 45 44 43 42 41 40 39 38 37
13 14 15 16 17 18 19 20 21 22 23 24
REFIN
REFOUT
NC
+VA
AGND
+IN
−IN
+VA +VA
AGND AGND
AGND
+VBD
DB4
DB5
DB6
DB7
DB8
DB9
DB10
DB11
AGND
AGND
+VA
BUSY BDGND +VBD NC NC
NC
NC DB0 DB1 DB3 BDGND
NC − No internal connection
NOTE: The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
DB2