Datasheet


SLAS400B − SEPTEMBER 2003 − REVISED NOVEMBER 2005
www.ti.com
2
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to
damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
MODEL
MAXIMUM
INTEGRAL
LINEARITY
(LSB)
MAXIMUM
DIFFERENTIAL
LINEARITY
(LSB)
NO MISSING
CODES AT
RESOLUTION
(BIT)
PACKAGE
TYPE
PACKAGE
DESIGNATOR
TEMPERATURE
RANGE
ORDERING
INFORMATION
TRANSPORT
MEDIA QUANTITY
±1
±1
12
48-Pin
PFB
−40°C to 85°C
ADS7881IPFBT
Tape and reel
250
ADS7881
±
1
±
1
12
48-Pin
TQFP
PFB
−40
°
C to 85
°
C
ADS7881IPFBR
Tape and reel
1000
ADS7881
±1
±1
12
48-Pin
RGZ
−40°C to 85°C
ADS7881IRGZT
Tape and reel
250
±
1
±
1
12
48-Pin
QFN
RGZ
−40
°
C to 85
°
C
ADS7881IRGZR
Tape and reel
2500
NOTE
:
For most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site
at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range
(1)
UNIT
+IN to AGND −0.3 V to +VA + 0.1 V
−IN to AGND −0.3 V to 0.5 V
+VA to AGND −0.3 V to 7 V
+VBD to BDGND −0.3 V to 7 V
Digital input voltage to GND −0.3 V to (+VBD + 0.3 V)
Digital output to GND −0.3 V to (+VBD + 0.3 V)
Operating temperature range −40°C to 85°C
Storage temperature range −65°C to 150°C
Junction temperature (T
J
max) 150°C
TQFP and QFN packages
Power dissipation (T
J
Max–T
A
)/ θ
JA
TQFP and QFN packages
θ
JA
Thermal impedance 86°C/W
Lead temperature, soldering
Vapor phase (60 sec) 215°C
Lead temperature, soldering
Infrared (15 sec) 220°C
(1)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.