Datasheet

ADS7843
2
SBAS090B
www.ti.com
PIN NAME DESCRIPTION
1+V
CC
Power Supply, 2.7V to 5V.
2 X+ X+ Position Input. ADC input Channel 1.
3 Y+ Y+ Position Input. ADC input Channel 2.
4X– X– Position Input
5Y– Y– Position Input
6 GND Ground
7 IN3 Auxiliary Input 1. ADC input Channel 3.
8 IN4 Auxiliary Input 2. ADC input Channel 4.
9V
REF
Voltage Reference Input
10 +V
CC
Power Supply, 2.7V to 5V.
11 PENIRQ Pen Interrupt. Open anode output (requires 10kΩ
to 100kΩ pull-up resistor externally).
12 DOUT Serial Data Output. Data is shifted on the falling
edge of DCLK. This output is high impedance
when CS is HIGH.
13 BUSY Busy Output. This output is high impedance when
CS is HIGH.
14 DIN Serial Data Input. If CS is LOW, data is latched on
rising edge of DCLK.
15 CS Chip Select Input. Controls conversion timing and
enables the serial input/output register.
16 DCLK External Clock Input. This clock runs the SAR con-
version process and synchronizes serial data I/O.
ABSOLUTE MAXIMUM RATINGS
(1)
+V
CC
to GND ........................................................................ –0.3V to +6V
Analog Inputs to GND ............................................ –0.3V to +V
CC
+ 0.3V
Digital Inputs to GND ............................................. –0.3V to +V
CC
+ 0.3V
Power Dissipation .......................................................................... 250mW
Maximum Junction Temperature ................................................... +150°C
Operating Temperature Range ........................................–40°C to +85°C
Storage Temperature Range .........................................–65°C to +150°C
Lead Temperature (soldering, 10s) ............................................... +300°C
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
1
2
3
4
5
6
7
8
+V
CC
X+
Y+
X–
Y–
GND
IN3
IN4
DCLK
CS
DIN
BUSY
DOUT
PENIRQ
+V
CC
V
REF
16
15
14
13
12
11
10
9
ADS7843
PIN CONFIGURATION
Top View SSOP
PIN DESCRIPTION
MAXIMUM
INTEGRAL
SPECIFIED
LINEARITY PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT ERROR (LSB) PACKAGE-LEAD DESIGNATOR
(1)
RANGE MARKING NUMBER MEDIA, QUANTITY
ADS7843E ±2 SSOP-16 DBQ –40°C to +85°C ADS7843E ADS7843E Rails, 100
"" " " "ADS7843E ADS7843E/2K5 Tape and Reel, 2500
NOTES: (1) For the most current specifications and package information, refer to our web site at www.ti.com.
PACKAGE/ORDERING INFORMATION