Datasheet
ADS7842
SBAS103C
2
www.ti.com
PIN NAME DESCRIPTION
1 AIN0 Analog Input Channel 0
2 AIN1 Analog Input Channel 1
3 AIN2 Analog Input Channel 2
4 AIN3 Analog Input Channel 3
5V
REF
Voltage Reference Input. See Electrical Characteris-
tics Tables for ranges.
6 AGND Analog Ground
7 DB11 Data Bit 11 (MSB)
8 DB10 Data Bit 10
9 DB9 Data Bit 9
10 DB8 Data Bit 8
11 DB7 Data Bit 7
12 DB6 Data Bit 6
13 DB5 Data Bit 5
14 DGND Digital Ground
15 DB4 Data Bit 4
16 DB3 Data Bit 3
17 DB2 Data Bit 2
18 DB1 Data Bit 1
19 DB0 Data Bit 0 (LSB)
20 RD Read Input. Active LOW. Reads the data outputs in
combination with CS.
21 CS Chip Select Input. Active LOW. The combination of
CS taken LOW and WR taken LOW initiates a new
conversion and places the outputs in the tri-state
mode.
22 WR Write Input. Active LOW. Starts a new conversion
and selects an analog channel via address inputs A0
and A1, in combination with CS.
23 BUSY BUSY goes LOW and stays LOW during a
conversion. BUSY rises when a conversion is
complete and enables the parallel outputs.
24 CLK External Clock Input. The clock speed determines the
conversion rate by the equation f
CLK
= 16 • f
SAMPLE
.
25, 26 A0, A1 Address Inputs. Selects one of four analog input
channels in combination with CS and WR. The
address inputs are latched on the rising edge of
either RD or WR.
A1 A0 Channel Selected
0 0 AIN0
0 1 AIN1
1 0 AIN2
1 1 AIN3
27 V
DIG
Digital Supply Input. Nominally +5V.
28 V
ANA
Analog Supply Input. Nominally +5V.
MINIMUM
RELATIVE SPECIFIED
ACCURACY SINAD PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT (LSB) (dB) PACKAGE-LEAD DESIGNATOR
(1)
RANGE MARKING NUMBER MEDIA, QUANTITY
ADS7842E ±2 68 SSOP-28 DB –40°C to +85°C ADS7842E ADS7842E Rails, 48
"""""""ADS7842E/1K Tape and Reel, 1000
ADS7842EB ±1 70 SSOP-28 DB –40°C to +85°C ADS7842EB ADS7842EB Rails, 48
"""""""ADS7842EB/1K Tape and Reel, 1000
ABSOLUTE MAXIMUM RATINGS
(1)
+V
CC
to GND ........................................................................ –0.3V to +6V
Analog Inputs to GND ............................................ –0.3V to +V
CC
+ 0.3V
Digital Inputs to GND ........................................................... –0.3V to +6V
Power Dissipation .......................................................................... 250mW
Maximum Junction Temperature ................................................... +150°C
Operating Temperature Range ........................................–40°C to +85°C
Storage Temperature Range ......................................... –65°C to +150°C
Lead Temperature (soldering, 10s) ............................................... +300°C
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
PACKAGE/ORDERING INFORMATION
PIN CONFIGURATION
Top View SSOP
PIN DESCRIPTIONS
1
2
3
4
5
6
7
8
8
10
11
12
13
14
AIN0
AIN1
AIN2
AIN3
V
REF
AGND
DB11
DB10
DB9
DB8
DB7
DB6
DB5
DGND
V
ANA
V
DIG
A1
A0
CLK
BUSY
WR
CS
RD
DB0
DB1
DB2
DB3
DB4
28
27
26
25
24
23
22
21
20
19
18
17
16
15
ADS7842E
NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.