Datasheet

6-1
EVM BOM and Schematic
EVM BOM and Schematic
Topic Page
6.1 EVM Schematic 6-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
The following table contains a complete bill of materials for the modular
MSOP8 EVM bill of materials.
Table 6−1.Bill of Materials
Qty.
Designators Description Manufacturer Mfg. Part Number
1 N/A Printed Wiring Board TI 6450845
0 C2 C3 C4 C13 Not Installed
0 R11 Not Installed
1 C1 0.47 µF, 0805, ceramic, X7R, 16 V, 10% Panasonic ECJ−2FB1C474K
2 C11 C12 0.1 µF, 0805, ceramic, X7R, 50 V, 10% Panasonic ECJ−2YB1H104K
3 C6 C8 C10 10 µF, 1206, ceramic, X7R, 10 V, 10% Murata GRM31CR71A106KA01L
3 C5 C14 C15 10 µF, A case, tantalum, 10 V AVX TAJA106M010RNJ
3 L1 L2 L3 15 µH inductor, SMT, 1608 Series Inductors, Inc. CTDS1608C−153
2 J1 J2 (top side) 10 Pin, dual row, SMT header (20 [pos) Samtec TSM−110−01−T−DV−P
2 J1B J2B (bottom side) 10 Pin, dual row, SMT socket (20 pos) Samtec SSW−110−22−F−D−VS−K
1 J3 (bottom side) 5 Pin, dual row, SMT socket (10 pos) Samtec SSW−105−22−F−D−VS−K
2 R9 R10 R12 33 Ω, 0805, 5%, 0.1W Resistor Yageo America RC0805JR−0733RL
4 R1 R2 R3 R4 R6 0 Ω, 0805, 0.1 W resistor Yageo America RC0805JR−070RL
5 TP1 TP2 TP3 TP5 TP7 Red test point loop Keystone 5001
2 TP4 TP6 Black test point loop Keystone 5000
0 U1 Varies (see Note)
1 U2 REF3025 TI REF3025AIDBZT
3 U3 U5 U6 SN74LVC1G125 TI SN74LVC1G125DBVT
1 U4 OPA353N TI OPA353NA/250
3 JMP1 JMP2 JMP5 3 Pin , 2 mm header Samtec TMMH−103−T−S
1 JMP3 4 Pin, dual row, TH header (8 positive) Samtec TSW−104−07−L−D
Note: The device installed at location U1 is dependent on the EVM ordered. This device is soldered to the board for best perfor-
mance. U1 may be replaced with any device listed in the EVM compatible device data sheets table found at the beginning
of this document.
Chapter 6