Datasheet

ADS7809
2
SBAS017C
www.ti.com
Analog Inputs: R1
IN
.......................................................................... ±25V
R2
IN
.......................................................................... ±25V
R3
IN
.......................................................................... ±25V
REF ................................. V
ANA
+ 0.3V to AGND2 – 0.3V
CAP ....................................... Indefinite Short to AGND2,
......................................................................... Momentary Short to V
ANA
Ground Voltage Differences: DGND, AGND2 ................................. ±0.3V
V
ANA
...................................................................................................... 7V
V
DIG
to V
ANA
....................................................................................... +0.3
V
DIG
....................................................................................................... 7V
Digital Inputs ............................................................ –0.3V to V
DIG
+ 0.3V
Maximum Junction Temperature .................................................. +165°C
Internal Power Dissipation ............................................................ 700mW
Lead Temperature (soldering, 10s) .............................................. +300°C
ABSOLUTE MAXIMUM RATINGS
(1)
MINIMUM
SIGNAL-TO-
MAXIMUM NO MISSING (NOISE + SPECIFIED
LINEARITY CODE LEVEL DISTORTION) PACKAGE- PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT ERROR (LSB) (LSB) RATIO (dB) LEAD DESIGNATOR RANGE MARKING NUMBER MEDIA, QUANTITY
ADS7809U ±31583SO-20DW–40°C to +85°C ADS7809U ADS7809U Rail, 38
"
""""" " "ADS7809U/1K Tape and Reel, 1000
ADS7809UB ±21686
"" "ADS7809UB ADS7809UB Rail, 38
"
""""" " "ADS7809UB/1K Tape and Reel, 1000
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com.
PACKAGE/ORDERING INFORMATION
(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
NOTE: (1) Stresses above those listed under Absolute Maximum Ratings may
cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.