Datasheet
ABSOLUTE MAXIMUM RATINGS
(1)
ADS7229
ADS7230
SBAS437A – MAY 2008 – REVISED JUNE 2009 ...............................................................................................................................................................
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
MAXIMUM MAXIMUM MAXIMUM
INTEGRAL DIFFERENTIAL OFFSET TRANSPORT
LINEARITY LINEARITY ERROR PACKAGE PACKAGE TEMPERATURE ORDERING MEDIA,
MODEL (LSB) (LSB) (mV) TYPE DESIGNATOR RANGE INFORMATION QUANTITY
ADS7229IRSAT Small tape and reel, 250
4 × 4 QFN-16 RSA
ADS7229IRSAR Tape and reel, 3000
ADS7229I ± 0.5 ± 0.5 ± 1.25 – 40 ° C to +85 ° C
ADS7229IPW Tube, 90
TSSOP-16 PW
ADS7229IPWR Tape and reel, 2000
ADS7230IRSAT Small tape and reel, 250
4 × 4 QFN-16 RSA
ADS7230IRSAR Tape and reel, 3000
ADS7230I ± 0.5 ± 0.5 ± 1.25 – 40 ° C to +85 ° C
ADS7230IPW Tube, 90
TSSOP-16 PW
ADS7230IPWR Tape and reel, 2000
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com .
Over operating free-air temperature range, unless otherwise noted.
ADS7229, ADS7230 UNIT
+IN to AGND – 0.3 to +VA + 0.3 V
Voltage
– IN to AGND – 0.3 to +VA + 0.3 V
+VA to AGND – 0.3 to 7 V
+REF to AGND – 0.3 to +VA + 0.3 V
Voltage range – REF to AGND – 0.3 to 0.3 V
+VBD to BDGND – 0.3 to 7 V
AGND to BDGND – 0.3 to 0.3 V
Digital input voltage to BDGND – 0.3 to +VBD + 0.3 V
Digital output voltage to BDGND – 0.3 to +VBD + 0.3 V
T
A
Operating free-air temperature range – 40 to +85 ° C
T
STG
Storage temperature range – 65 to +150 ° C
T
J
Junction temperature +150 ° C
max
Power dissipation (T
J
max – T
A
)/ θ
JA
4 × 4 QFN-16
package
θ
JA
thermal impedance 47 ° C/W
Power dissipation (T
J
max – T
A
)/ θ
JA
TSSOP-16
package
θ
JA
thermal impedance 86 ° C/W
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
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