Datasheet

ADS8363
ADS7263
ADS7223
SBAS523B –OCTOBER 2010–REVISED JANUARY 2011 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this
document, or visit the device product folder at www.ti.com.
FAMILY OVERVIEW
PRODUCT RESOLUTION NMC INL SNR THD
ADS8363 16 bits 16 or 15 bits
(1)
±3 or ±4 LSB
(1)
93dB (typ) –98dB (typ)
ADS7263 14 bits 14 bits ±1 LSB 85dB (typ) –92dB (typ)
ADS7223 12 bits 12 bits ±0.5 LSB 73dB (typ) –86dB (typ)
(1) See Electrical Characteristics.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range, unless otherwise noted.
ADS8363, ADS7263, ADS7223 UNIT
Supply voltage, AVDD to AGND or DVDD to DGND –0.3 to +6 V
Supply voltage, DVDD to AVDD 1.2 × AVDD
(2)
V
Analog and reference input voltage with respect to AGND AGND – 0.3 to AVDD + 0.3 V
Digital input voltage with respect to DGND DGND – 0.3 to DVDD + 0.3 V
Ground voltage difference |AGND-DGND| 0.3 V
Input current to any pin except supply pins –10 to +10 mA
Maximum virtual junction temperature, T
J
+150 °C
Human body model (HBM),
±2000 V
Electrostatic
JEDEC standard 22, test method A114-C.01
discharge (ESD)
Charged device model (CDM),
ratings, all pins
±500 V
JEDEC standard 22, test method C101
(1) Stresses above these ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the
device at these or any other conditions beyond those specified is not implied. Exposure to absolute maximum conditions for extended
periods may affect device reliability.
(2) Exceeding the specified limit causes an increase of the DVDD leakage current and leads to malfunction of the device.
THERMAL INFORMATION
ADS8363,
ADS7263,
ADS7223
THERMAL METRIC
(1)
UNITS
RHB
32 PINS
q
JA
Junction-to-ambient thermal resistance 33.3
q
JCtop
Junction-to-case (top) thermal resistance 29.5
q
JB
Junction-to-board thermal resistance 7.3
°C/W
y
JT
Junction-to-top characterization parameter 0.2
y
JB
Junction-to-board characterization parameter 7.4
q
JCbot
Junction-to-case (bottom) thermal resistance 0.9
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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Product Folder Link(s): ADS8363 ADS7263 ADS7223