Datasheet
www.ti.com
ABSOLUTE MAXIMUM RATINGS
(1)
ADS6424
ADS6423
ADS6422
SLAS532A – MAY 2007 – REVISED JUNE 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
PACKAGE/ORDERING INFORMATION
(1)
SPECIFIED TRANSPORT
PACKAGE PACKAGE
PRODUCT PACKAGE-LEAD TEMPERATURE ORDERING NUMBER MEDIA,
DESIGNATOR MARKING
RANGE QUANTITY
ADS6424IRGCT 250, Tape/reel
ADS6424 QFN-64
(2)
RGC – 40 ° C to 85 ° C AZ6424
ADS6424IRGCR 2000, Tape/reel
ADS6423IRGCT 250, Tape/reel
ADS6423 QFN-64
(2)
RGC – 40 ° C to 85 ° C AZ6423
ADS6423IRGCR 2000, Tape/reel
ADS6422IRGCT 250, Tape/reel
ADS6422 QFN-64
(2)
RGC – 40 ° C to 85 ° C AZ6422
ADS6422IRGCR 2000, Tape/reel
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com .
(2) For thermal pad size on the package, see the mechanical drawings at the end of this data sheet. θ
JA
= 23.17 ° C/W (0 LFM air flow), θ
JC
= 22.1 ° C/W when used with 2 oz. copper trace and pad soldered directly to a JEDEC standard four layer 3 in. x 3 in. PCB.
VALUE UNIT
AVDD Supply voltage range – 0.3 to 3.9 V
LVDD Supply voltage range – 0.3 to 3.9 V
Voltage between AGND and DGND – 0.3 to 0.3 V
Voltage between AVDD to LVDD – 0.3 to 3.3 V
Voltage applied to external pin, VCM – 0.3 to 2.0 V
Voltage applied to analog input pins – 0.3V to minimum ( 3.6, AVDD + 0.3V) V
T
A
Operating free-air temperature range – 40 to 85 ° C
T
J
Operating junction temperature range 125 ° C
T
stg
Storage temperature range – 65 to 150 ° C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Copyright © 2007, Texas Instruments Incorporated 3
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