Datasheet

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ABSOLUTE MAXIMUM RATINGS
(1)
Production Data
ADS5541
SBAS307C – MAY 2004 – REVISED FEBRUARY 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ORDERING INFORMATION
(1)
SPECIFIED
PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT PACKAGE-LEAD
(2)
DESIGNATOR RANGE MARKING NUMBER MEDIA, QUANTITY
ADS5541IPAP Tray, 160
HTQFP-64
ADS5541 PAP –40°C to +85°C ADS5541I
PowerPAD
ADS5541IPAPR Tape and Reel, 1000
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com .
(2) Thermal pad size: 3.5mm × 3.5mm (min), 4mm × 4mm (max). θ
JA
= 21.47°C/W and θ
JC
= 2.99°C/W, when used with 2 oz. copper trace
and pad soldered directly to a JEDEC standard, four-layer, 3in × 3in PCB.
Over operating free-air temperature range, unless otherwise noted.
ADS5541 UNIT
AV
DD
to A
GND
, DRV
DD
to DR
GND
–0.3 to 3.7 V
Supply Voltage
A
GND
to DR
GND
±0.1 V
Analog input to A
GND
(2) (3)
–0.3 to minimum (AV
DD
+ 0.3, +3.6) V
Logic input to DR
GND
–0.3 to DRV
DD
V
Digital data output to DR
GND
–0.3 to DRV
DD
V
Operating temperature range –40 to 85 °C
Junction temperature 105 °C
Storage temperature range –65 to 150 °C
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) If the input signal can exceed 3.6V, then a resistor greater than or equal to 25 Ω should be added in series with each of the analog input
pins to support input voltages up to 3.8V. For input voltages above 3.8V, the device can only handle transients and the duty cycle of the
overshoot should be limited to less than 5% for inputs up to 3.9V.
(3) The overshoot duty cycle can be defined as the ratio of the total time of overshoot to the total intended device lifetime, expressed as a
percentage. The total time of overshoot is the integrated time of all overshoot occurences over the lifetime of the device.
2
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