Datasheet

REFERENCE CIRCUIT DESIGN
CLOCKING
REF
T
REF
B
I
SET
0.1
µ
F 2.2
µ
F
2
56.2k
2
2.2
µ
F 0.1
µ
F
ADS5270
ADS5270
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............................................................................................................................................... SBAS293F JANUARY 2004 REVISED JANUARY 2009
The device also supports the use of external
reference voltages. This mode involves forcing REF
T
The digital beam-forming algorithm relies on gain
and REF
B
externally. In this mode, the internal
matching across all receiver channels. A typical
reference buffer is tri-stated. Since the switching
system would have about 12 octal ADCs on the
current for the eight ADCs come from the
board. In such a case, it is critical to ensure that the
externally-forced references, it is possible for the
gain is matched, essentially requiring the reference
performance to be slightly less than when the internal
voltages seen by all the ADCs to be the same.
references are used. It should be noted that in this
Matching references within the eight channels of a
mode, V
CM
and I
SET
continue to be generated from
chip is done by using a single internal reference
the internal bandgap voltage, as in the internal
voltage buffer. Trimming the reference voltages on
reference mode. It is therefore important to ensure
each chip during production ensures the reference
that the common-mode voltage of the
voltages are well-matched across different chips.
externally-forced reference voltages matches to
within 50mV of V
CM
. The state of the reference
All bias currents required for the internal operation of
voltages during various combinations of PD and
the device are set using an external resistor to
INT/ EXT is shown in Table 1 .
ground at pin I
SET
. Using a 56k resistor on I
SET
generates an internal reference current of 20A. This
Table 1. State of Reference Voltages for Various
current is mirrored internally to generate the bias
Combinations of PD and INT/ EXT
current for the internal blocks. Using a larger external
resistor at I
SET
reduces the reference bias current and
PD 0 0 1 1
thereby scales down the device operating power.
INT/ EXT 0 1 0 1
However, it is recommended that the external resistor
REF
T
Tri-State 1.95V Tri-State Tri-State
be within 10% of the specified value of 56k so that
REF
B
Tri-State 0.95V Tri-State Tri-State
the internal bias margins for the various blocks are
proper.
V
CM
1.45V 1.45V Tri-State
(1)
Tri-State
(1)
Buffering the internal bandgap voltage also generates
a voltage called V
CM
, which is set to the midlevel of
REF
T
and REF
B
, and is accessible on a pin. It is
The eight channels on the chip operate from a single
meant as a reference voltage to derive the input
ADCLK input. To ensure that the aperture delay and
common-mode in case the input is directly coupled. It
jitter are same for all the channels, a clock tree
can also be used to derive the reference
network is used to generate individual sampling
common-mode voltage in the external reference
clocks to each channel. The clock paths for all the
mode.
channels are matched from the source point all the
way to the sample-and-hold amplifier. This ensures
When using the internal reference mode, a 2
that the performance and timing for all the channels
resistor should be added between the reference pins
are identical. The use of the clock tree for matching
(REF
T
and REF
B
) and the decoupling capacitor, as
introduces an aperture delay, which is defined as the
shown in Figure 17 . If the device is used in the
delay between the rising edge of ADCLK and the
external reference mode, this 2 resistor is not
actual instant of sampling. The aperture delays for all
required.
the channels are matched to the best possible extent.
However, a mismatch of ± 20ps ( ± 3 σ ) could exist
between the aperture instants of the eight ADCs
within the same chip. However, the aperture delays of
ADCs across two different chips can be several
hundred picoseconds apart. Another critical
specification is the aperture jitter that is defined as
the uncertainty of the sampling instant. The gates in
the clock path are designed to provide an rms jitter of
approximately 1ps.
Ideally, the input ADCLK should have a 50% duty
cycle. However, while routing ADCLK to different
components onboard, the duty cycle of the ADCLK
reaching the ADS5270 could deviate from 50%. A
smaller (or larger) duty cycle reduces the time
available for sample or hold phases of each circuit,
and is therefore not optimal. For this reason, the
Figure 17. Internal Reference Mode
internal PLL is used to generate an internal clock that
has 50% duty cycle. The input sampling instant,
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