Datasheet

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SBAS274H − MARCH 2003 − REVISED MAY 2007
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2
ORDERING INFORMATION
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PRODUCT PACKAGE−LEAD
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
ADS1605
HTQFP−64
PAP
−40°C to +85°C
ADS1605I
ADS1605IPAPT Tape and Reel, 250
ADS1605
HTQFP−64
PAP
−40
°
C to +85
°
C
ADS1605I
ADS1605IPAPR Tape and Reel, 1000
ADS1606
HTQFP−64
PAP
−40°C to +85°C
ADS1606I
ADS1606IPAPT Tape and Reel, 250
ADS1606
HTQFP−64
PAP
−40
°
C to +85
°
C
ADS1606I
ADS1606IPAPR Tape and Reel, 1000
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For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI web
site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
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ADS1605, ADS1606 UNIT
AVDD to AGND −0.3 to +6 V
DVDD to DGND −0.3 to +3.6 V
IOVDD to DGND −0.3 to +6 V
AGND to DGND −0.3 to +0.3 V
Input Current 100mA, Momentary
Input Current 10mA, Continuous
Analog I/O to AGND −0.3 to AVDD + 0.3 V
Digital I/O to DGND −0.3 to IOVDD + 0.3 V
Maximum Junction Temperature +150 °C
Operating Temperature Range −40 to +105 °C
Storage Temperature Range −60 to +150 °C
Lead Temperature (soldering, 10s) +260 °C
(1)
Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not implied.
PRODUCT FAMILY
PRODUCT RESOLUTION DATA RATE FIFO?
ADS1605 16 Bits 5.0MSPS No
ADS1606 16 Bits 5.0MSPS Yes
ADS1625 18 Bits 1.25MSPS No
ADS1626 18 Bits 1.25MSPS Yes
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.