Datasheet

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SBAS274H − MARCH 2003 − REVISED MAY 2007
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5
ELECTRICAL CHARACTERISTICS (continued)
All specifications at −40°C to +85°C, AVDD = 5V, DVDD = IOVDD = 3V, f
CLK
= 40MHz, External V
REF
= +3V, 2XMODE = low, V
CM
= 2.0V,
FIFO disabled, and R
BIAS
= 37kΩ, unless otherwise noted.
PARAMETER UNITMAXTYPMINTEST CONDITIONS
Voltage Reference
(1)
V
REF
= (VREFP − VREFN) 2.5 3.0 3.2 V
VREFP 3.75 4.0 4.25 V
VREFN 0.75 1.0 1.25 V
VMID 2.3 2.5 2.8 V
V
REF
drift Internal reference (REFEN = low) 50 ppm/°C
Startup time Internal reference (REFEN = low) 15 ms
Clock Input
Frequency (f
CLK
) 40 50 MHz
Duty Cycle f
CLK
= 40MHz 45 55 %
Digital Input/Output
V
IH
0.7 IOVDD IOVDD V
V
IL
DGND 0.3 IOVDD V
V
OH
I
OH
= 50µA IOVDD − 0.5 V
V
OL
I
OL
= 50µA DGND +0.5 V
Input leakage DGND < V
DIGIN
< IOVDD ±10 µA
Power-Supply Requirements
AVDD 4.75 5.25 V
DVDD 2.7 3.3 V
IOVDD 2.7 5.25 V
AVDD current (I
AVDD
)
REFEN = low 110 135 mA
AVDD current (I
AVDD
)
REFEN = high 85 105 mA
DVDD current (I
DVDD
) 45 55 mA
IOVDD current (I
IOVDD
) IOVDD = 3V 4 6 mA
Power dissipation
AVDD = 5V, DVDD = 3V, IOVDD = 3V,
REFEN = high
570 710 mW
Power dissipation
PD = low, CLK disabled 5 mW
Temperature Range
Specified −40 +85 °C
Operating −40 +105 °C
Storage −60 +150 °C
Thermal Resistance, θ
JA PowerPAD soldered to PCB with 2oz.
trace and copper pad.
25 °C/W
θ
JC
PowerPAD soldered to PCB with 2oz.
trace and copper pad.
0.5 °C/W
(1)
The specification limits for VREF, VREFP, VREFN, and VMID apply when using the internal or an external reference. The internal reference
voltages are bounded by the limits shown. When using an external reference, the limits indicate the allowable voltages that can be applied to
the reference pins.