Datasheet
40mils(1mm)
40mils(1mm)
40mils(1mm)
118mils(3mm)
40mils(1mm)
118mils(3mm)
ThermalVia
13mils(0.33mm)
316mils(8mm)
316mils(8mm)
ThermalPad
PackageOutline
ADS1274
ADS1278
SBAS367F –JUNE 2007–REVISED FEBRUARY 2011
www.ti.com
Figure 93. Thermal Pad Etch and Via Pattern for the HTQFP-64 Package
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Product Folder Link(s): ADS1274 ADS1278