Datasheet

ICDie

WireBond WireBond

LeadframeDiePad

ExposedatBaseofPackage

DieAttachEpoxy

(thermallyconductive)

Leadframe

MoldCompound

(Epoxy)

ADS1274

ADS1278

SBAS367F –JUNE 2007–REVISED FEBRUARY 2011

www.ti.com

PowerPAD THERMALLY-ENHANCED die pad to be attached to the PCB using standard

PACKAGING flow soldering techniques. This configuration allows

efficient attachment to the PCB and permits the board

The PowerPAD concept is implemented in standard

structure to be used as a heatsink for the package.

epoxy resin package material. The integrated circuit

Using a thermal pad identical in size to the die pad

is attached to the leadframe die pad using thermally

and vias connected to the PCB ground plane, the

conductive epoxy. The package is molded so that the

board designer can now implement power packaging

leadframe die pad is exposed at a surface of the

without additional thermal hardware (for example,

package. This design provides an extremely low

external heatsinks) or the need for specialized

thermal resistance to the path between the IC

assembly instructions.

junction and the exterior case. The external surface

of the leadframe die pad is located on the printed Figure 91 illustrates a cross-section view of a

circuit board (PCB) side of the package, allowing the PowerPAD package.

Figure 91. Cross-Section View of a PowerPAD Thermally-Enhanced Package

Product Folder Link(s): ADS1274 ADS1278