Datasheet
ADS1240, 1241
2
SBAS173F
www.ti.com
DIGITAL CHARACTERISTICS: –40°C to +85°C, DV
DD
2.7V to 5.25V
PARAMETER CONDITIONS MIN TYP MAX UNITS
Digital Input/Output
Logic Family CMOS
Logic Level: V
IH
0.8 • DV
DD
DV
DD
V
V
IL
DGND 0.2 • DV
DD
V
V
OH
I
OH
= 1mA DV
DD
– 0.4 V
V
OL
I
OL
= 1mA DGND DGND + 0.4 V
Input Leakage: I
IH
V
I
= DV
DD
10 µA
I
IL
V
I
= 0 –10 µA
Master Clock Rate: f
OSC
15MHz
Master Clock Period: t
OSC
1/f
OSC
200 1000 ns
AV
DD
to DGND ...................................................................... –0.3V to +6V
DV
DD
to DGND ...................................................................... –0.3V to +6V
Input Current ............................................................... 100mA, Momentary
DGND to AGND ....................................................................–0.3V to 0.3V
Input Current ................................................................. 10mA, Continuous
A
IN
.................................................................AGND –0.5V to AV
DD
+ 0.5V
Digital Input Voltage to DGND ................................. –0.3V to DV
DD
+ 0.3V
Digital Output Voltage to DGND .............................. –0.3V to DV
DD
+ 0.3V
Maximum Junction Temperature ................................................... +150°C
Operating Temperature Range ......................................... –40°C to +85°C
Storage Temperature Range .......................................... –60°C to +150°C
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability.
ABSOLUTE MAXIMUM RATINGS
(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
For the most current package and ordering information, see
the Package Option Addendum at the end of this document,
or see the TI website at www.ti.com.
PACKAGE/ORDERING INFORMATION