Datasheet

ADS1231
SBAS414D –JULY 2009–REVISED OCTOBER 2013 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this
document, or visit the device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range, unless otherwise noted.
ADS1231 UNIT
AVDD to GND –0.3 to +6 V
DVDD to GND –0.3 to +6 V
100, momentary mA
Input current
10, continuous mA
Analog input voltage to GND –0.3 to AVDD + 0.3 V
Digital input voltage to GND –0.3 to DVDD + 0.3 V
Human body model (HBM)
±2000 V
JEDEC standard 22, test method A114-C.01, all pins
ESD
(2)
Charged device model (CDM)
±500 V
JEDEC standard 22, test method C101, all pins
Maximum junction temperature +150 °C
Operating temperature range –40 to +85 °C
Storage temperature range –60 to +150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability.
(2) CAUTION: ESD sensitive device. Precaution should be used when handling the device in order to prevent permanent damage.
THERMAL INFORMATION
ADS1231
THERMAL METRIC
(1)
SOIC (D) UNITS
16 PINS
θ
JA
Junction-to-ambient thermal resistance 79.5
θ
JCtop
Junction-to-case (top) thermal resistance 37.5
θ
JB
Junction-to-board thermal resistance 37.1
°C/W
ψ
JT
Junction-to-top characterization parameter 5.6
ψ
JB
Junction-to-board characterization parameter 36.7
θ
JCbot
Junction-to-case (bottom) thermal resistance n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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