Datasheet

This package incorporates an exposed thermal pad that is designed to be attached directly to an external heatsink. The 
thermal pad must be soldered directly to the printed circuit board (PCB). After soldering, the PCB can be used as a 
heatsink. In addition, through the use of thermal vias, the thermal pad can be attached directly to the appropriate copper 
plane shown in the electrical schematic for the device, or alternatively, can be attached to a special heatsink structure 
designed into the PCB. This design optimizes the heat transfer from the integrated circuit (IC).