Datasheet

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SBAS312BJANUARY 2005 − REVISED AUGUST 2007
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2
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to
damage because very small parametric changes could cause the device not to meet its published specifications.
Package/Ordering Information
For the most current package and ordering information, see the Package Option Addendum at the end of this document,
or see the TI web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
ADS1205 UNIT
Supply voltage, AGND to AV
DD
−0.3 to 6 V
Supply voltage, BGND to BV
DD
−0.3 to 6 V
Analog input voltage with respect to AGND AGND − 0.3 to AV
DD
+ 0.3 V
Reference input voltage with respect to AGND AGND − 0.3 to AV
DD
+ 0.3 V
Digital input voltage with respect to BGND BGND − 0.3 to BV
DD
+ 0.3 V
Ground voltage difference, AGND to BGND ±0.3 V
Voltage differences, BV
DD
to AGND −0.3 to 6 V
Input current to any pin except supply ±10 mA
Power dissipation See Dissipation Rating table
Operating virtual junction temperature range, T
J
−40 to +150 °C
Operating free-air temperature range, T
A
−40 to +85 °C
Storage temperature range, T
STG
−65 to +150 °C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATINGS
PACKAGE
T
A
25°C
POWER RATING
DERATING FACTOR
ABOVE T
A
= 25°C
(1)
T
A
= 70°C
POWER RATING
T
A
= 85°C
POWER RATING
QFN-24 (4x4) 2193mW 21.929mW/°C 1206mW 877.2mW
(1)
This is the inverse of the traditional junction-to-ambient thermal resistance (R
q JA
). Thermal resistances are not production tested and are for
informational purposes only.
RECOMMENDED OPERATING CONDITIONS
PARAMETER MIN NOM MAX UNIT
Supply voltage, AGND to AV
DD
4.5 5 5.5 V
Supply voltage, BGND to BV
DD
Low-Voltage Levels 2.7 3.6 V
Supply voltage, BGND to BV
DD
5V Logic Levels 4.5 5 5.5 V
Reference input voltage 0.5 2.5 2.6 V
Operating common-mode signal −IN 2.5 V
Analog inputs +IN − (−IN) ±0.8 × REFIN V
External clock
(1)
16 20 24 MHz
Operating junction temperature range, T
J
−40 105 °C
(1)
With reduced accuracy, clock can go from 1MHz up to 33MHz; see Typical Characteristics.