Datasheet
PIN ASSIGNMENTS
CHA+
CHA-
CHB+
CHB-
CHC-
CHC+
CHD-
CHD+
OUTA
OUTB
OUTC
OUTD
CLKOUT
BGND
BV
DD
CLKIN
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
ADS1204
REFINA
32
REFIND
9
REFINB
REFINC
AGND
AGND
AV
DD
AV
DD
REFOUT
NC
AV
DD
AV
DD
AGND
AGND
NC
CLKSEL
31
25
26
28
27
29
30
16
15
14
13
12
11
10
ADS1204
SBAS301C – OCTOBER 2003 – REVISED FEBRUARY 2009 ...........................................................................................................................................
www.ti.com
RHB PACKAGE
(1)
QFN-32
(TOP VIEW)
(1) The thermal pad is internally connected to the substrate. This pad can be connected to the analog ground or left floating. Keep the
thermal pad separate from the digital ground, if possible.
TERMINAL FUNCTIONS
TERMINAL
NAME NO. I/O
(1)
DESCRIPTION
CH A+ 1 AI Analog input of channel A: noninverting input
CH A – 2 AI Analog input of channel A: inverting input
CH B+ 3 AI Analog input of channel B: noninverting input
CH B – 4 AI Analog input of channel B: inverting input
CH C – 5 AI Analog input of channel C: inverting input
CH C+ 6 AI Analog input of channel C: noninverting input
CH D – 7 AI Analog input of channel D: inverting input
CH D+ 8 AI Analog input of channel D: noninverting input
REFIN D 9 AI Reference voltage input of channel D: pin for external reference voltage
REFIN C 10 AI Reference voltage input of channel C: pin for external reference voltage
AGND 11 — Analog ground
AVDD 12 P Analog power supply; nominal 5V
NC 13 — No connection; this pin is left unconnected
AV
DD
14 P Analog power supply; nominal 5V
AGND 15 — Analog ground
CLKSEL 16 I Clock select between internal clock (CLKSEL = 1) or external clock (CLKSEL = 0)
CLKIN 17 I External clock input
BV
DD
18 P Digital interface power supply; from 2.7V to 5.5V
BGND 19 — Interface ground
CLKOUT 20 O System clock output
(1) AI = Analog Input; AO = Analog Output; I = Input; O = Output; P = Power Supply.
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Product Folder Link(s): ADS1204