Datasheet

ADS1194, ADS1196
ADS1198
SBAS471C –APRIL 2010– REVISED NOVEMBER 2011 www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
Minimum/maximum specifications apply from 0°C to +70°C. Typical specifications are at +25°C.
All specifications at DVDD = 1.8V, AVDD – AVSS = 3V, V
REF
= 2.4V, external f
CLK
= 2.048MHz, data rate = 500SPS, and
gain = 6, unless otherwise noted.
ADS1194, ADS1196, ADS1198
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER DISSIPATION (Analog Supply = 3V, RLD, WCT, and Pace Amplifiers Turned Off)
Quiescent power dissipation
ADS1194 Normal mode 3 3.3 mW
ADS1196 Normal mode 3.6 4 mW
ADS1198 Normal mode 4.3 4.8 mW
Power-down 10 μW
Standby mode 2 mW
Quiescent channel power PGA + ADC 350 µW
POWER DISSIPATION (Analog Supply = 5V, RLD, WCT, and Pace Amplifiers Turned Off)
Quiescent power dissipation
ADS1194 Normal mode 5.7 mW
ADS1196 Normal mode 6.9 mW
ADS1198 Normal mode 8.2 mW
Power-down 20 μW
Standby mode, internal reference 4 mW
Quiescent channel power PGA + ADC 620 µW
TEMPERATURE
Specified temperature range 0 +70 °C
Operating temperature range 0 +70 °C
Storage temperature range –60 +150 °C
THERMAL INFORMATION
ADS1194/6/8 ADS1194/6/8
THERMAL METRIC
(1)
PAG ZXG UNITS
64 PINS 64 PINS
θ
JA
Junction-to-ambient thermal resistance 29 29
θ
JCtop
Junction-to-case (top) thermal resistance 10.4 10.4
θ
JB
Junction-to-board thermal resistance 14.8 14.8
°C/W
ψ
JT
Junction-to-top characterization parameter 0.2 0.2
ψ
JB
Junction-to-board characterization parameter 8.2 8.2
θ
JCbot
Junction-to-case (bottom) thermal resistance n/a n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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