Datasheet

PowerPAD THERMALLY-ENHANCED
ICDie
WireBond WireBond
LeadframeDiePad
ExposedatBaseofPackage
DieAttachEpoxy
(thermallyconductive)
Leadframe
MoldCompount
(Epoxy)
ADS1174
ADS1178
SBAS373B – OCTOBER 2007 – REVISED SEPTEMBER 2008 ........................................................................................................................................ www.ti.com
the PCB using standard flow soldering techniques.
PACKAGING This soldering allows efficient attachment to the PCB
and permits the board structure to be used as a
The PowerPAD concept is implemented in standard
heat-sink for the package. Using a thermal pad
epoxy resin package material. The integrated circuit
identical in size to the die pad and vias connected to
is attached to the leadframe die pad using thermally
the PCB ground plane, the board designer can now
conductive epoxy. The package is molded so that the
implement power packaging without additional
leadframe die pad is exposed at a surface of the
thermal hardware (for example, external heat sinks)
package. This exposure provides an extremely low
or the need for specialized assembly instructions.
thermal resistance to the path between the IC
junction and the exterior case. The external surface Figure 29 illustrates a cross-section view of a
of the leadframe die pad is located on the PCB side PowerPAD package.
of the package, allowing the die pad to be attached to
Figure 29. Cross-Section View of a PowerPAD Thermally-Enhanced Package
28 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178