Datasheet

ADC141S626
www.ti.com SNAS434B –NOVEMBER 2007–REVISED MARCH 2013
Absolute Maximum Ratings
(1)(2)(3)
Analog Supply Voltage V
A
−0.3V to 6.5V
Digital I/O Supply Voltage V
IO
−0.3V to 6.5V
Voltage on Any Analog Input Pin to GND −0.3V to (V
A
+ 0.3V)
Voltage on Any Digital Input Pin to GND −0.3V to (V
IO
+ 0.3V)
Input Current at Any Pin
(4)
±10 mA
Package Input Current
(4)
±50 mA
Power Consumption at T
A
= 25°C See
(5)
Human Body Model 4000V
ESD Susceptibility
(6)
Machine Model 300V
Charge Device Model 1250V
Junction Temperature +150°C
Storage Temperature −65°C to +150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see
the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics
may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the maximum Operating
Ratings is not recommended.
(2) All voltages are measured with respect to GND = 0V, unless otherwise specified.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(4) When the input voltage at any pin exceeds the power supplies (that is, V
IN
< GND or V
IN
> V
A
), the current at that pin should be limited
to 10 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an
input current of 10 mA to five.
(5) The absolute maximum junction temperature (T
J
max) for this device is 150°C. The maximum allowable power dissipation is dictated by
T
J
max, the junction-to-ambient thermal resistance (θ
JA
), and the ambient temperature (T
A
), and can be calculated using the formula
P
D
MAX = (T
J
max − T
A
)/θ
JA
. The values for maximum power dissipation listed above will be reached only when the ADC141S626 is
operated in a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply
polarity is reversed). Such conditions should always be avoided.
(6) Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is a 220 pF capacitor discharged
through 0 Ω. Charge device model simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an
automated assembler) then rapidly being discharged.
Operating Ratings
(1)(2)
Operating Temperature Range −40°C ≤ T
A
≤ +85°C
Supply Voltage, V
A
+2.7V to +5.5V
Supply Voltage, V
IO
+2.7V to +5.5V
Reference Voltage, V
REF
1.0V to V
A
Analog Input Pins Voltage Range 0 to V
A
Differential Analog Input Voltage −V
REF
to +V
REF
Input Common-Mode Voltage, V
CM
See Figure 41
Digital Input Pins Voltage Range 0 to V
IO
Clock Frequency 0.9 MHz to 4.5 MHz
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see
the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics
may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the maximum Operating
Ratings is not recommended.
(2) All voltages are measured with respect to GND = 0V, unless otherwise specified.
Package Thermal Resistance
(1)(2)
Package θ
JA
10-lead VSSOP 240°C / W
(1) Soldering process must comply with TI's Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.
(2) Reflow temperature profiles are different for lead-free packages.
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