Datasheet

ADC12EU050
www.ti.com SNAS444I –JANUARY 2008–REVISED APRIL 2013
PIN DESCRIPTIONS (continued)
Pin No. Name Type Function and Connection
Word Clock. Differential output frame clock. Information on timing
38 WCLK+ can be seen in ELECTRICAL CHARACTERISTICS.
Output
39 WCLK- By programming TX_term (bit 4) in the LVDS Control register, it is
possible to internally terminate these outputs with 100 ohm resistors.
SPI data input and output. This pin is used to send and receive SPI
44 S
DATA
Input/Output address and data information. The direction of the pin is controlled
internally by the ADC based on the SPI protocol.
SPI clock. In order to use the SPI interface, a clock must be provided
45 S
CLK
Input on this pin. See ELECTRICAL CHARACTERISTICS for SPI clock
and timing information.
SPI chip select. This active low pin is used to enable the serial
46 S
SEL
Input
interface.
Differential Input Clock. The input clock must be 45MHz. It is used
47 CLK+ (SE)
Input by the PLL to generate the internal sampling clocks. A single ended
48 CLK-
clock can also be used, and should be connected to pin 47.
POWER SUPPLY
1, 8, 51, 54, Analog Power Supply. All pins should be connected to the same
57, 60, 63, V
A
Power 1.2V supply, with voltage limits as in the Electrical Specification.
66
0 AGND Ground Analog Ground Return.
11, 12, 42, Digital Power Supply. Connect to 1.2V, with voltage limits as in the
V
D
Power
43 Electrical Specification.
13, 14, 22,
DGND Ground Digital and Output Driver Ground Return.
30, 40, 41
Output Driver Power Supply. Can be connected to 1.2V – 1.8V,
17, 27, 35 V
DR
Power depending on application requirements. Voltage limits are described
in more detail in the Electrical Specification.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
(1)(2)
Supply Voltage (V
A
, V
D
) −0.3V to 1.4V
IO Supply Voltage (V
DR
) -0.3 to 2.0V
Voltage at Analog Inputs -0.3 to 1.4V
Voltage at SPI Inputs -0.3 to 2.5V
Input Current, V
IN
+, V
IN
- ±1mA
Input Current, other pins ±10mA
ESD Susceptibility Human Body Model 2000V
Machine Model 200V
Charged Device Mode 1,000V
Soldering Temperature Infrared, 10 seconds 235°C
Storage Temperature Range −65°C to +125°C
Soldering process must comply with Texas Instruments' Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.
(1) Absolute maximum ratings are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that
the device should be operated at these limits.
(2) All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified.
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