Datasheet
TIME
VOLTAGE
Measured
Battery Voltage
V
LOW
Limit
ALERT pin
(Active Low)
V
LOW
+V
HYST
ADC101C021, ADC101C027
SNAS446D –FEBRUARY 2008–REVISED FEBRUARY 2013
www.ti.com
Figure 38. Trickle Charge
LAYOUT, GROUNDING, AND BYPASSING
For best accuracy and minimum noise, the printed circuit board containing the ADC101C021 should have
separate analog and digital areas. The areas are defined by the locations of the analog and digital power planes.
Both of these planes should be located on the same board layer. A single, solid ground plane is preferred if
digital return current does not flow through the analog ground area. Frequently a single ground plane design will
utilize a "fencing" technique to prevent the mixing of analog and digital ground currents. Separate ground planes
should only be utilized when the fencing technique is inadequate. The separate ground planes must be
connected in one place, preferably near the ADC121C021. Special care is required to guarantee that signals do
not pass over power plane boundaries. Return currents must always have a continuous return path below their
traces.
The ADC101C021 power supply should be bypassed with a 4.7µF and a 0.1µF capacitor as close as possible to
the device with the 0.1µF right at the device supply pin. The 4.7µF capacitor should be a tantalum type and the
0.1µF capacitor should be a low ESL type. The power supply for the ADC101C021 should only be used for
analog circuits.
Avoid crossover of analog and digital signals and keep the clock and data lines on the component side of the
board. The clock and data lines should have controlled impedances.
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