Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
ADC0844CCN NRND PDIP NFH 20 18 TBD Call TI Call TI 0 to 70 ADC0844CCN
ADC0844CCN/NOPB ACTIVE PDIP NFH 20 18 Green (RoHS
& no Sb/Br)
SN Level-1-NA-UNLIM 0 to 70 ADC0844CCN
ADC0848BCV NRND PLCC FN 28 35 TBD Call TI Call TI -40 to 85 ADC0848
BCV
ADC0848BCV/NOPB ACTIVE PLCC FN 28 35 Green (RoHS
& no Sb/Br)
SN Level-2A-245C-4
WEEK
-40 to 85 ADC0848
BCV
ADC0848BCVX/NOPB ACTIVE PLCC FN 28 750 Green (RoHS
& no Sb/Br)
SN Level-2A-245C-4
WEEK
-40 to 85 ADC0848
BCV
ADC0848CCN NRND PDIP NAM 24 15 TBD Call TI Call TI -40 to 85 ADC0848CCN
ADC0848CCN/NOPB ACTIVE PDIP NAM 24 15 Pb-Free
(RoHS)
Call TI Level-1-NA-UNLIM -40 to 85 ADC0848CCN
ADC0848CCV NRND PLCC FN 28 35 TBD Call TI Call TI -40 to 85 ADC0848
CCV
ADC0848CCV/NOPB ACTIVE PLCC FN 28 35 Green (RoHS
& no Sb/Br)
SN Level-2A-245C-4
WEEK
-40 to 85 ADC0848
CCV
ADC0848CCVX NRND PLCC FN 28 750 TBD Call TI Call TI -40 to 85 ADC0848
CCV
ADC0848CCVX/NOPB ACTIVE PLCC FN 28 750 Green (RoHS
& no Sb/Br)
SN Level-2A-245C-4
WEEK
-40 to 85 ADC0848
CCV
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.