Datasheet

ADC081S051
www.ti.com SNAS309E –APRIL 2005–REVISED MARCH 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)(3)
Analog Supply Voltage V
A
−0.3V to 6.5V
Voltage on Any Analog Pin to GND −0.3V to (V
A
+0.3V)
Voltage on Any Digital Pin to GND −0.3V to 6.5V
Input Current at Any Pin
(4)
±10 mA
Package Input Current
(4)
±20 mA
Power Consumption at T
A
= 25°C See
(5)
Human Body Model 3500V
ESD Susceptibility
(6)
Machine Model 300V
Junction Temperature +150°C
Storage Temperature −65°C to +150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) All voltages are measured with respect to GND = 0V, unless otherwise specified.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(4) When the input voltage at any pin exceeds the power supply (that is, V
IN
< GND or V
IN
> V
A
), the current at that pin should be limited to
10 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an
input current of 10 mA to two. The Absolute Maximum Rating specification does not apply to the V
A
pin. The current into the V
A
pin is
limited by the Analog Supply Voltage specification.
(5) The absolute maximum junction temperature (T
J
max) for this device is 150°C. The maximum allowable power dissipation is dictated by
T
J
max, the junction-to-ambient thermal resistance (θ
JA
), and the ambient temperature (T
A
), and can be calculated using the formula
P
D
MAX = (T
J
max − T
A
)/θ
JA
. The values for maximum power dissipation listed above will be reached only when the device is operated in
a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is
reversed). Obviously, such conditions should always be avoided.
(6) Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through zero ohms
Operating Ratings
(1)(2)
Operating Temperature Range −40°C ≤ T
A
≤ +85°C
V
A
Supply Voltage +2.7V to +5.25V
Digital Input Pins Voltage Range (regardless of supply voltage) −0.3V to 5.25V
Analog Input Pins Voltage Range 0V to V
A
Clock Frequency 25 kHz to 20 MHz
Sample Rate up to 1Msps
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) All voltages are measured with respect to GND = 0V, unless otherwise specified.
Package Thermal Resistance
(1)
Package θ
JA
6-lead WSON 94°C / W
6-lead SOT-23 265°C / W
(1) Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging. Reflow temperature
profiles are different for lead-free and non-lead-free packages.
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