Datasheet

ADC08100
www.ti.com SNAS060I –JUNE 2000–REVISED MAY 2013
PIN DESCRIPTIONS AND EQUIVALENT CIRCUITS (continued)
Pin No. Symbol Equivalent Circuit Description
13 thru 16 Conversion data digital Output pins. D0 is the LSB, D7 is the
and D0–D7 MSB. Valid data is output just after the rising edge of the CLK
19 thru 22 input.
7 V
IN
GND Reference ground for the single-ended analog input, V
IN
.
Positive analog supply pin. Connect to a clean, quiet voltage
source of +3V. V
A
should be bypassed with a 0.1 µF ceramic
1, 4, 12 V
A
chip capacitor for each pin, plus one 10 µF capacitor. See
POWER SUPPLY CONSIDERATIONS for more information.
Power supply for the output drivers. If connected to V
A
,
18 DR V
D
decouple well from V
A
.
17 DR GND The ground return for the output driver supply.
2, 5, 8, 11 AGND The ground return for the analog supply.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)(3)
Supply Voltage (V
A
) 3.8V
Driver Supply Voltage (DR V
D
) V
A
+ 0.3V
Voltage on Any Input or Output Pin −0.3V to V
A
Reference Voltage (V
RT
, V
RB
) V
A
to AGND
CLK, OE Voltage Range −0.3V to
(V
A
+ 0.3V)
Digital Output Voltage (V
OH
, V
OL
) DR GND to DR V
D
Input Current at Any Pin
(4)
±25 mA
Package Input Current
(4)
±50 mA
Power Consumption at T
A
= 25°C See
(5)
ESD Susceptibility
(6)
Human Body Model 2500V
Machine Model 250V
Soldering Temperature, Infrared, 10 seconds 235°C
Storage Temperature −65°C to +150°C
(1) All voltages are measured with respect to GND = AGND = DR GND = 0V, unless otherwise specified.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see
Converter Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance
characteristics may degrade when the device is not operated under the listed test conditions.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(4) When the input voltage at any pin exceeds the power supplies (that is, less than AGND or DR GND, or greater than V
A
or DR V
D
), the
current at that pin should be limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can
safely exceed the power supplies with an input current of 25 mA to two.
(5) The absolute maximum junction temperature (T
J
max) for this device is 150°C. The maximum allowable power dissipation is dictated by
T
J
max, the junction-to-ambient thermal resistance (θ
JA
), and the ambient temperature (T
A
), and can be calculated using the formula
P
D
MAX = (T
J
max − T
A
) / θ
JA
. In the 24-pin TSSOP, θ
JA
is 92°C/W. The power consumption of this device under normal operating
conditions is far below the package limit, which will be reached only when the ADC08100 is operated in a severe fault condition (e.g.,
when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Obviously, such
conditions should always be avoided.
(6) Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through ZERO
Ohms.
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