Datasheet

PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
74ACT11244DBLE OBSOLETE SSOP DB 24 TBD Call TI Call TI
74ACT11244DBR ACTIVE SSOP DB 24 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74ACT11244DBRE4 ACTIVE SSOP DB 24 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74ACT11244DBRG4 ACTIVE SSOP DB 24 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74ACT11244DW ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74ACT11244DWE4 ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74ACT11244DWG4 ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74ACT11244DWR ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74ACT11244DWRE4 ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74ACT11244DWRG4 ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74ACT11244NT ACTIVE PDIP NT 24 15 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
74ACT11244NTE4 ACTIVE PDIP NT 24 15 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
74ACT11244PW ACTIVE TSSOP PW 24 60 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74ACT11244PWE4 ACTIVE TSSOP PW 24 60 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74ACT11244PWG4 ACTIVE TSSOP PW 24 60 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74ACT11244PWLE OBSOLETE TSSOP PW 24 TBD Call TI Call TI
74ACT11244PWR ACTIVE TSSOP PW 24 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74ACT11244PWRE4 ACTIVE TSSOP PW 24 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74ACT11244PWRG4 ACTIVE TSSOP PW 24 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
PACKAGE OPTION ADDENDUM
www.ti.com 1-Apr-2010
Addendum-Page 1