74AC11032 QUADRUPLE 2-INPUT POSITIVE-OR GATE SCAS007C – JULY 1987 – REVISED APRIL 1996 D D D D D, DB, OR N PACKAGE (TOP VIEW) Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC (Enhanced-Performance Implanted CMOS) 1-µm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Shrink Small-Outline (DB) Packages, and Standard Plastic 300-mil DIPs (N) 1A 1Y 2Y GND GND 3Y 4Y 4B 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9
74AC11032 QUADRUPLE 2-INPUT POSITIVE-OR GATE SCAS007C – JULY 1987 – REVISED APRIL 1996 logic diagram (positive logic) 1A 1B 2A 2B 3A 3B 4A 4B 1 2 16 15 14 11 3 6 10 9 8 7 1Y 2Y 3Y 4Y absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . .
74AC11032 QUADRUPLE 2-INPUT POSITIVE-OR GATE SCAS007C – JULY 1987 – REVISED APRIL 1996 recommended operating conditions VCC Supply voltage VIH High-level input voltage VCC = 3 V VCC = 4.5 V VCC = 5.5 V VCC = 3 V MIN NOM MAX 3 5 5.5 0.9 VI VO Input voltage 0 Output voltage 0 IOH High-level output current ∆t/∆v Input transition rise or fall rate TA Operating free-air temperature V 3.85 Low-level input voltage Low-level output current V 2.1 3.15 VIL IOL UNIT VCC = 4.
74AC11032 QUADRUPLE 2-INPUT POSITIVE-OR GATE SCAS007C – JULY 1987 – REVISED APRIL 1996 switching characteristics over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A or B Y MIN TA = 25°C TYP MAX MIN MAX 1.5 6.3 8.7 1.5 9.7 1.5 5.4 7.4 1.5 8 UNIT ns switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.
PACKAGE OPTION ADDENDUM www.ti.
PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing 74AC11032DBR SSOP 74AC11032DR 74AC11032NSR SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 12.0 16.0 Q1 DB 16 2000 330.0 16.4 8.2 6.6 2.5 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.
PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 74AC11032DBR SSOP DB 16 2000 346.0 346.0 33.0 74AC11032DR SOIC D 16 2500 333.2 345.9 28.6 74AC11032NSR SO NS 16 2000 346.0 346.0 33.
MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters.
PACKAGE OPTION ADDENDUM www.ti.
PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing 74AC11032DBR SSOP 74AC11032DR 74AC11032NSR SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 12.0 16.0 Q1 DB 16 2000 330.0 16.4 8.2 6.6 2.5 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 74AC11032DBR SSOP DB 16 2000 367.0 367.0 38.0 74AC11032DR SOIC D 16 2500 333.2 345.9 28.6 74AC11032NSR SO NS 16 2000 367.0 367.0 38.
MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters.
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