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74AC11004

HEX INVERTER

SCAS033B − JANUARY 1988 − REVISED APRIL 1996

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

D Flow-Through Architecture Optimizes

PCB Layout

D Center-Pin V

and GND Configuration

Minimizes High-Speed Switching Noise

D EPIC ™ (Enhanced-Performance Implanted

CMOS) 1-μm Process

D 500-mA Typical Latch-Up Immunity at

125°C

D Package Options Include Plastic

Small-Outline (DW) and Shrink

Small-Outline (DB) Packages, and Standard

Plastic 300-mil DIPs (N)

description

This device contains six independent inverters. It performs the Boolean function Y = A.

The 74AC11004 is characterized for operation from −40°C to 85°C.

FUNCTION TABLE

(each inverter)

INPUT

OUTPUT

H L

L H

logic symbol

†

This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

EPIC is a trademark of Texas Instruments Incorporated.

GND

DB, DW, OR N PACKAGE

(TOP VIEW)

NC − No internal connection

Summary of content (13 pages)

PAGE 1
74AC11004 HEX INVERTER SCAS033B − JANUARY 1988 − REVISED APRIL 1996 D Flow-Through Architecture Optimizes D D D D DB, DW, OR N PACKAGE (TOP VIEW) PCB Layout Center-Pin VCC and GND Configuration Minimizes High-Speed Switching Noise EPIC ™ (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small-Outline (DB) Packages, and Standard Plastic 300-mil DIPs (N) 1Y 2Y 3Y GND GND GND GND 4Y 5Y 6Y 1 20 2 19
PAGE 2
74AC11004 HEX INVERTER SCAS033B − JANUARY 1988 − REVISED APRIL 1996 logic diagram (positive logic) 1A 2A 3A 4A 5A 6A 20 1 19 2 18 3 13 8 12 9 11 10 1Y 2Y 3Y 4Y 5Y 6Y absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . .
PAGE 3
74AC11004 HEX INVERTER SCAS033B − JANUARY 1988 − REVISED APRIL 1996 recommended operating conditions VCC Supply voltage VCC = 3 V VIH High-level High level input voltage MIN NOM MAX 3 5 5.5 Low-level Low level input voltage VI Input voltage VO Output voltage VCC = 4.5 V 3.15 VCC = 5.5 V 3.85 V 0.9 VCC = 4.5 V 1.35 VCC = 5.5 V 1.
PAGE 4
74AC11004 HEX INVERTER SCAS033B − JANUARY 1988 − REVISED APRIL 1996 switching characteristics over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1) PARAMETER tPLH tPHL FROM (INPUT) TO (OUTPUT) A Y TA = 25°C MAX MIN MAX MIN TYP 1.5 6.1 9 1.5 10 1.5 5.2 7.4 1.5 8.2 UNIT ns switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.
PAGE 5
PACKAGE OPTION ADDENDUM www.ti.
PAGE 6
PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.
PAGE 7
PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device 74AC11004DWR Package Package Pins Type Drawing SOIC DW 20 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 24.4 Pack Materials-Page 1 10.8 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 13.3 2.7 12.0 24.
PAGE 8
PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 74AC11004DWR SOIC DW 20 2000 367.0 367.0 45.
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MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters.
PAGE 13
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.