Datasheet
LMH6611
ADC121S101
0.1 PF
10 PF
0.1 PF
10 PF
0.1 PF
V
+
0.01 PF
R6
14.3 k:
0.1 PF
1 PF
GND
5V
R
5
1.24 k:
C
2
1 nF
C
5
150 pF
R
2
549:
V
+
-
+
R
L
22:
C
L
390 pF
R
1
549:
IN
1 PF
V
+
R
7
14.3 k:
5.6 PF
U1
LMH6611, LMH6612
SNOSB00K –NOVEMBER 2007–REVISED OCTOBER 2013
www.ti.com
DESCRIPTION (CONTINUED)
The amplifiers will operate on a 2.7V to 11V single supply or ±1.35V to ±5.5V split supply. The LMH6611 single
is available in 6-Pin SOT and has an independent active low disable pin which reduces the supply current to 120
µA. The LMH6612 is available in 8-Pin SOIC. Both the LMH6611 and LMH6612 are available in −40°C to
+125°C extended industrial temperature grade.
Typical Application
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
For input pins only 2000V
Human Body Model
For all other pins 2000V
ESD Tolerance
(3)
Machine Model 200V
Charge Device Model 1000V
Supply Voltage (V
S
= V
+
– V
−
) 12V
Junction Temperature
(4)
150°C max
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
) – T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
Operating Ratings
(1)
Supply Voltage (V
S
= V
+
– V
−
) 2.7V to 11V
Ambient Temperature Range
(2)
−40°C to +125°C
6-Pin SOT 231°C/W
Package Thermal Resistance (θ
JA
)
8-Pin SOIC 160°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
) – T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
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Product Folder Links: LMH6611 LMH6612