User's Manual
Table Of Contents
- 1 Device Overview
- Table of Contents
- 2 Revision History
- 3 Device Comparison
- 4 Terminal Configuration and Functions
- 5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings
- 5.3 Recommended Operating Conditions
- 5.4 Power Consumption Summary
- 5.5 General Characteristics
- 5.6 Antenna
- 5.7 1-Mbps GFSK (Bluetooth low energy) – RX
- 5.8 1-Mbps GFSK (Bluetooth low energy) – TX
- 5.9 2-Mbps GFSK (Bluetooth low energy) – RX
- 5.10 2-Mbps GFSK (Bluetooth low energy) – TX
- 5.11 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – RX
- 5.12 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – TX
- 5.13 24-MHz Crystal Oscillator (XOSC_HF)
- 5.14 32.768-kHz Crystal Oscillator (XOSC_LF)
- 5.15 48-MHz RC Oscillator (RCOSC_HF)
- 5.16 32-kHz RC Oscillator (RCOSC_LF)
- 5.17 ADC Characteristics
- 5.18 Temperature Sensor
- 5.19 Battery Monitor
- 5.20 Continuous Time Comparator
- 5.21 Low-Power Clocked Comparator
- 5.22 Programmable Current Source
- 5.23 DC Characteristics
- 5.24 Thermal Resistance Characteristics for MOH Package
- 5.25 Timing Requirements
- 5.26 Switching Characteristics
- 5.27 Typical Characteristics
- 6 Detailed Description
- 7 Application, Implementation, and Layout
- 8 Device and Documentation Support
- 9 Mechanical Packaging and Orderable Information
- Important Notice
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CC2650MOD
SWRS187 –AUGUST 2016
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Specifications Copyright © 2016, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to ground, unless otherwise noted.
(3) Including analog capable DIO.
5 Specifications
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)(2)
MIN MAX UNIT
VDDS Supply voltage –0.3 4.1 V
Voltage on any digital pin
(3)
–0.3 VDDS + 0.3, max 4.1 V
V
in
Voltage on ADC input
Voltage scaling enabled –0.3 VDDS
VVoltage scaling disabled, internal reference –0.3 1.49
Voltage scaling disabled, VDDS as reference –0.3 VDDS / 2.9
Input RF level 5 dBm
T
stg
Storage temperature –40 85 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
5.2 ESD Ratings
VALUE UNIT
V
ESD
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC
JS001
(1)
All pins ±2500
V
Charged device model (CDM), per JESD22-C101
(2)
RF pins ±750
Non-RF pins ±750
5.3 Recommended Operating Conditions
MIN MAX UNIT
Ambient temperature –40 85 °C
Operating supply voltage (VDDS)
For operation in battery-powered and 3.3-V
systems
(internal DC-DC can be used to minimize power
consumption)
1.8 3.8 V