User's Manual
Table Of Contents
- 1 Device Overview
- Table of Contents
- 2 Revision History
- 3 Device Comparison
- 4 Terminal Configuration and Functions
- 5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings
- 5.3 Recommended Operating Conditions
- 5.4 Power Consumption Summary
- 5.5 General Characteristics
- 5.6 Antenna
- 5.7 1-Mbps GFSK (Bluetooth low energy) – RX
- 5.8 1-Mbps GFSK (Bluetooth low energy) – TX
- 5.9 2-Mbps GFSK (Bluetooth low energy) – RX
- 5.10 2-Mbps GFSK (Bluetooth low energy) – TX
- 5.11 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – RX
- 5.12 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – TX
- 5.13 24-MHz Crystal Oscillator (XOSC_HF)
- 5.14 32.768-kHz Crystal Oscillator (XOSC_LF)
- 5.15 48-MHz RC Oscillator (RCOSC_HF)
- 5.16 32-kHz RC Oscillator (RCOSC_LF)
- 5.17 ADC Characteristics
- 5.18 Temperature Sensor
- 5.19 Battery Monitor
- 5.20 Continuous Time Comparator
- 5.21 Low-Power Clocked Comparator
- 5.22 Programmable Current Source
- 5.23 DC Characteristics
- 5.24 Thermal Resistance Characteristics for MOH Package
- 5.25 Timing Requirements
- 5.26 Switching Characteristics
- 5.27 Typical Characteristics
- 6 Detailed Description
- 7 Application, Implementation, and Layout
- 8 Device and Documentation Support
- 9 Mechanical Packaging and Orderable Information
- Important Notice
PRODUCTPREVIEW
39
CC2650MOD
www.ti.com
SWRS187 –AUGUST 2016
Submit Documentation Feedback
Product Folder Links: CC2650MOD
Mechanical Packaging and Orderable InformationCopyright © 2016, Texas Instruments Incorporated
8.9 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
8.10 Export Control Notice
Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data
(as defined by the U.S., EU, and other Export Administration Regulations) including software, or any
controlled product restricted by other applicable national regulations, received from Disclosing party under
this Agreement, or any direct product of such technology, to any destination to which such export or re-
export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from
U.S. Department of Commerce and other competent Government authorities to the extent required by
those laws.
8.11 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
9 Mechanical Packaging and Orderable Information
9.1 Packaging Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.