User's Manual
Table Of Contents
- 1 Device Overview
- Table of Contents
- 2 Revision History
- 3 Device Comparison
- 4 Terminal Configuration and Functions
- 5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings
- 5.3 Recommended Operating Conditions
- 5.4 Power Consumption Summary
- 5.5 General Characteristics
- 5.6 Antenna
- 5.7 1-Mbps GFSK (Bluetooth low energy) – RX
- 5.8 1-Mbps GFSK (Bluetooth low energy) – TX
- 5.9 2-Mbps GFSK (Bluetooth low energy) – RX
- 5.10 2-Mbps GFSK (Bluetooth low energy) – TX
- 5.11 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – RX
- 5.12 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – TX
- 5.13 24-MHz Crystal Oscillator (XOSC_HF)
- 5.14 32.768-kHz Crystal Oscillator (XOSC_LF)
- 5.15 48-MHz RC Oscillator (RCOSC_HF)
- 5.16 32-kHz RC Oscillator (RCOSC_LF)
- 5.17 ADC Characteristics
- 5.18 Temperature Sensor
- 5.19 Battery Monitor
- 5.20 Continuous Time Comparator
- 5.21 Low-Power Clocked Comparator
- 5.22 Programmable Current Source
- 5.23 DC Characteristics
- 5.24 Thermal Resistance Characteristics for MOH Package
- 5.25 Timing Requirements
- 5.26 Switching Characteristics
- 5.27 Typical Characteristics
- 6 Detailed Description
- 7 Application, Implementation, and Layout
- 8 Device and Documentation Support
- 9 Mechanical Packaging and Orderable Information
- Important Notice
PRODUCTPREVIEW
SimpleLink™ Multistandard
Wireless MCU
DEVICE FAMILY
PREFIX
CC2650 MOD
X = Experimental device
Blank = Qualified device
MOH
A
ROM version 1
Flash = 128KB
DEVICE
PACKAGE DESIGNATOR
MOH = 29-pin Module
MOD = Module
35
CC2650MOD
www.ti.com
SWRS187 –AUGUST 2016
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Product Folder Links: CC2650MOD
Device and Documentation SupportCopyright © 2016, Texas Instruments Incorporated
8 Device and Documentation Support
8.1 Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to all part numbers and/or
date-code. Each device has one of three prefixes/identifications: X, P, or null (no prefix) (for example,
CC2650MOD is in production; therefore, no prefix/identification is assigned).
Device development evolutionary flow:
X Experimental device that is not necessarily representative of the final device's electrical
specifications and may not use production assembly flow.
P Prototype device that is not necessarily the final silicon die and may not necessarily meet
final electrical specifications.
null Production version of the silicon die that is fully qualified.
Production devices have been characterized fully, and the quality and reliability of the device have been
demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X or P) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system
because their expected end-use failure rate still is undefined. Only qualified production devices are to be
used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, MOH).
For orderable part numbers of CC2650MOD devices in the MOH package type, see the Package Option
Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.
Figure 8-1. Device Nomenclature