Datasheet

1
FEATURES
DBV PACKAGE
(TOP VIEW)
1
2
3
5
4
OE
A
GND
V
CC
Y
DESCRIPTION/ORDERING INFORMATION
SN74LVC1G126-Q1
www.ti.com
............................................................................................................................................................. SCES467B JULY 2003 REVISED APRIL 2008
SINGLE BUS BUFFER GATE
WITH 3-STATE OUTPUT
Qualified for Automotive Applications
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
Supports 5-V V
CC
Operation
Inputs Accept Voltages to 5.5 V
Low Power Consumption, 10- µ A Max I
CC
± 24-mA Output Drive at 3.3 V
I
off
Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
This single bus buffer gate is designed for 1.65-V to 5.5-V V
CC
operation.
The SN74LVC1G126-Q1 is a single line driver with a 3-state output. The output is disabled when the
output-enable (OE) input is low.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
40 ° C to 125 ° C SOT (SOT-23) DBV Reel of 3000 1P1G126QDBVRQ1 C26_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com .
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(3) DBV: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
FUNCTION TABLE
INPUTS
OUTPUT
Y
OE A
H H H
H L L
L X Z
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003 2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

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