User's Guide

WL865E4-P Module Hardware User Guide
1VV0301580 Rev. 4 Page 7 of 56 2019-08-08
Footprint ..................................................................................... 42
PCB pad design .......................................................................... 42
PCB pad dimensions .................................................................. 43
Stencil ......................................................................................... 43
Solder paste ............................................................................... 43
Solder Reflow ............................................................................. 44
10. PACKAGING .............................................................................. 46
Tray ............................................................................................ 46
Moisture sensitivity ..................................................................... 47
11. CONFORMITY ASSESSMENT ISSUES .................................... 48
FCC/IC Regulatory notices ......................................................... 48
12. FCC/IC COMPLIANCE ............................................................... 49
13. SAFETY RECOMMENDATIONS................................................ 52
READ CAREFULLY .................................................................... 52
14. ACRONYMS ............................................................................... 53
15. DOCUMENT HISTORY .............................................................. 55