User Guide

WE866C6 Hardware Design Guide
1VV0301658 Rev. 1 Page 47 of 58 2020-06-16
Solder Reflow
Below figure shows the recommended solder reflow profile.
Profile Feature
Pb-Free Assembly
Average ramp-up rate (T
L
to T
P
)
3°C/second max
Preheat
– Temperature Min (T
smin
)
– Temperature Max (T
smax
)
– Time (min to max) (t
s
)
150°C
200°C
60-180 seconds
T
smax
to T
L
– Ramp-up rate
3°C/second max
Time maintained above:
– Temperature (T
L
)
– Time (t
L
)
217°C
60-150 seconds
Peak temperature (T
p
)
245 +0/-5°C
Time within 5°C of actual peak temperature (t
p
)
10-30 seconds
Ramp-down rate
6°C/second max.
Time 25°C to peak temperature
8 minutes max.
WARNING:
The above solder reflow profile represents the typical SAC reflow limits and
does not guarantee adequate adherence of the module to the customer
application throughout the temperature range.
Customer must optimize the reflow profile depending on the overall system
considering such factors as thermal mass and warpage.
The module withstands one reflow process only.