User's Manual
Table Of Contents
- 1 Introduction
- 2 General Product Description
- 3 Application Interface
- 3.1 Power Supply
- 3.2 Reset
- 3.3 Serial Interface
- 3.4 GPIO Interface
- 3.5 I2C Interface 0F
- 3.6 SPI Serial Peripheral Interface
- 3.7 Bluetooth Radio Interface
- 1.1
- 3.8 NFC Function
- 3.9 Slow Clock Interface
- 3.10 Test Mode
- 3.11 Operating in a Power-Switched Environment
- 3.12 Serial Wire Debug Interface
- 3.13 DC/DC Converter
- 4 Module Pins
- 5 Electrical Characteristics
- 6 Mechanical Characteristics
- 7 Application Diagram
- 8 Compliances
- 9 Packing
- 10 Ordering Information
- 11 Safety Recommendations
- 12 Document History
BlueMod+S42 Hardware User Guide
1VV0301303 Rev.3 – 2016-08-22
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
Page 49 of 62
6.2 Recommended Land Pattern
F1
E1
D1
C1
B1
A1 A2 A3 A4 A5 A6 A7 A8
F2
E2
D2
C2
B2
F3
E3
D3
C3
B3
F4
E4
D4
C4
B4
F5
E5
D5
C5
B5
F6
E6
D6
C6
B6
F7
E7
D7
C7
B7
F8
E8
D8
C8
B8
1,25
1,25
7x1,5=10,5
5x1,5=7,5
0,9
17,0
10,0
Figure 17: BlueMod+S42 Land Pattern TOP VIEW
Note: All dimensions are in mm.
6.3 Re-flow Temperature-Time Profile
The data here is given only for guidance on solder and has to be adapted to your process and
other re-flow parameters for example the used solder paste. The paste manufacturer provides
a re-flow profile recommendation for his product.
Figure 18: Soldering Temperature-Time Profile (For Reflow Soldering)