User's Manual

BlueMod+C11/G2
Hardware Reference
www.stollmann.de Page 31 of 42
6.4 Soldering Temperature-Time Profile (for lead-free re-flow solder-
ing)
The data here is given only for guidance on solder and has to be adopted to your
process and other re-flow parameters for example the used solder paste. The paste
manufacturer provides a re-flow profile recommendation for his product.
For lead-free solder
Soldering Temperature-Time Profile (for reflow soldering)
Preheat
Main Heat
Peak
tsmax
tLmax
tpmax
Temperature
Time
Temperature
Time
Temperature
Time
[°C]
[sec]
[°C]
[sec]
[°C]
[sec]
150
90
217
90
260
10
230
30
Average ramp-up rate
[°C / sec]
3
Average ramp-down rate
[°C / sec]
6
Max. Time 25°C to Peak Tem-
perature
[min.]
8
Opposite side re-flow is prohibited due to module weight.
Devices will withstand the specified profile and will withstand up to 1 lead-free re-
flows to a maximum temperature of 260°C.