User's Manual

Stollmann
E + V GmbH
BlueMod+B20
Hardware reference
Author: bg Date of Saving: 28.03.07 Ref: BlueMod+B20_HWreference_V101.doc Revision: 1.00 Page 27 of 27
6.3 Re-flow Temperature-Time Profile
The data here is given only for guidance on solder and has to be adopted to your
process and other re-flow parameters for example the used solder paste. The paste
manufacturer provides a re-flow profile recommendation for his product.
Our used temp. profile
for reflow soldering
Temp .[°C]
Time [s]
230°C -250°C max.
220°C
150°C – 190°C
90 ±30s
30 +20/-10s
Opposite side re-flow is prohibited due to module weight.
Devices will withstand the specified profile and will withstand up to 2 re-flows to a
maximum temperature of 260°C.