Manualshelf

User Manual

ManualsBrandsTelit Communications ManualsElectronicsWIRELESS MODULE 2.4GHZ ZE51
31323334353637383940
ZE51/61-2.4 RF module User Guide
1VV0300868 Rev.4 – 31/03/2011
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 32 of 50
V.6. Soldering profile (RoHS process)
It must be noted that ZE51/61-2.4/SMD module should not be allowed to be hanging upside down during the reflow
operation. This means that the module has to be assembled on the side of the printed circuit board that is soldered
last.
The recommendation for lead-free solder reflow in IPC/JEDEC J-STD-020D Standard should be followed.