User Manual

ZE51/61-2.4 RF Module User Guide
1VV0300868 Rev.4 – 31/03/2011
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V.4. Solder paste composition (RoHS process)
ZE51/61-2.4/SMD module is designed for surface mounting using half-moon solder joints (see diagram below). For
proper module assembly, solder paste must be printed on the target surface of the host board. The solder paste
should be eutectic and made of 95.5% of SN, 4% of Ag and 0.5% of Cu. The recommended solder paste height is
180 μm .
The following diagram shows mounting characteristics for tiny integration on host PCB:
V.5. Placement
The ZE51/61-2.4/SMD module can be automatically placed on host boards by pick-and-place machines like any
integrated circuit.