User Manual

ZE51/61-2.4 RF Module User Guide
1VV0300868 Rev.4 – 31/03/2011
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V.2. Storage
The optimal storage environment for ZE51/61-2.4/SMD modules should be dust free, dry and the temperature
should be included between -40°C and +85°C.
In case of a reflow soldering process, tiny radio modules must be submitted to a drying bake at +60°C during 24
hours. The drying bake must be used prior to the reflow soldering process in order to prevent a popcorn effect.
After being submitted to the drying bake, tiny modules must be soldered on host boards within 168 hours.
Also, it must be noted that due to some components, ZE51/61-2.4/SMD modules are ESD sensitive device.
Therefore, ESD handling precautions should be carefully observed.
V.3. Soldering pad pattern
The surface finished on the printed circuit board pads should be made of Nickel/Gold surface.
The recommended soldering pad layout on the host board for the ZE51/61-2.4/SMD-WA, is shown in the diagram
below:
All dimensions in mm