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ZE51/61-2.4 RF Module User Guide

1VV0300868 Rev.4 – 31/03/2011

Summary of content (50 pages)

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ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.
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ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 31/03/2011 This document is related to the following product : Reproduction forbidden without Telit Communications S.p.A.
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ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 31/03/2011 DISCLAIMER The information contained in this document is the proprietary information of Telit Communications S.p.A. and its affiliates (“TELIT”). The contents are confidential and any disclosure to persons other than the officers, employees, agents or subcontractors of the owner or licensee of this document, without the prior written consent of Telit, is strictly prohibited.
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ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 31/03/2011 CONTENTS CHAPTER I. INTRODUCTION ................................................................................................................... 6 I.1. AIM OF THE DOCUMENT .................................................................................................................................................................................... 6 I.2. REFERENCE DOCUMENTS ...............................................................
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ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 31/03/2011 VI.3. RF LAYOUT CONSIDERATIONS ...................................................................................................................................................................... 36 VI.4. ANTENNA CONNECTION ON PRINTED CIRCUIT BOARDS............................................................................................................................. 37 VI.5. ZE51/61-2.4 INTERFACING : ..................................
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ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 31/03/2011 CHAPTER I. INTRODUCTION I.1. Aim of the Document The aim of this document is to present the features and the application of the ZE51/61-2.4 radio module. After the introduction, the characteristics of the ZE51/61-2.
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ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 31/03/2011 I.2. Reference documents [1] IEEE Std. 802.15.4-2006 Wireless MAC and PHY Specifications for Low Rate - WPANs ERC Recommendation for SRD, June 2009 [2] ERC Rec 70-03 [3] EN 300 328-1 V1.7.1 (Europe) ETSI Standards for SRD , October 2006 [4] EN 300 440-1 V1.4.
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ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 31/03/2011 I.4.
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ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 31/03/2011 CHAPTER II. REQUIREMENTS II.1. Regulations requirements The ZE51/61-2.4 module is a [1],[2],[6],[7] compliant multi channel radio modem in the 2.4GHz band (unlicensed frequency band). Europe Regulation: The “ERC recommendation 70-03” [2] describes the limits band in the 2.4GHz license free band, in terms of bandwidth, maximum power, duty cycle, channel spacing and type of application.
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ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 31/03/2011 Restrictions for non specific SR devices Annex 1h 2400-2483.5MHz: Country Restriction Norway Implemented Russian Federation Ukraine Reason/Remark This subsection does not apply for the geographical area within a radius of 20 km from the centre of Ny-Ålesund Bluetooth Limited implementation e.i.r.p. ≤100 mW Restrictions for Wideband Data Transmission systems Annex 3a 2400-2483.
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ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 31/03/2011 mW/MHz. Maximum 100 mW e.i.r.p. Permitted to use SRD for outdoor applications only for purposes of gathering telemetry information for automated monitoring and resources accounting systems or security systems. 2.3. Maximum mean e.i.r.p. density is 10 mW/MHz. Maximum 100 mW e.i.r.p. Indoor applications For the complete document please refer to [2] and EU Commission Decision [9], [10]. The 2.4 Ghz band is a harmonized band in most of Europe.
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ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 31/03/2011 II.2. Functional Requirements The ZE51/61-2.4 module is a complete solution from serial interface to RF interface. The ZE51/61-2.4 module has a digital part and a RF part. The digital part has the following functionalities: - Communication interface I/O management Micro controller with embedded software The RF part has the following functionalities: - 2.4 GHz IEEE 802.15.
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ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 31/03/2011 II.4. Temperature Requirements Minimum Typical Maximum Unit Temperature - 40 25 + 85 °C Relative humidity @ 25°C 20 75 % + 85 °C Operating Storage Temperature - 40 25 Reproduction forbidden without Telit Communications S.p.A.
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ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 31/03/2011 CHAPTER III. GENERAL CHARACTERISTICS III.1. Mechanical Characteristics Size : Rectangular 26 x 15 mm Height : 3 mm Weight : 1,7 g PCB thickness: 0.8 mm Cover :  Dimensions : 21 x 14 x 2.2mm  Thickness : 200µm Components : All SMD components, on one side of the PCB. Connectors : The terminals allowing conveying I/O signals are half-moons located around.
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ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 31/03/2011 III.2. Mechanical dimensions Reproduction forbidden without Telit Communications S.p.A.
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ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 31/03/2011 III.3. DC Characteristics Characteristics ZE51 Power Supply (VDD): Min. Typ. Max. +2.0V +3.0V +3.6V Consumption @ 3.0V and 25°C Transmission : 35mA Reception : 26mA Stand-by (32.768 khz On) : 2µA Sleep (wake up on interruption) : 1µA I/O low level : GND - 0.9 V I/O high level : VDD - 0.7V - VDD Min. Typ. Max. +2.0V +3.0V +3.6V Characteristics ZE61 Power Supply (VDD): Consumption @ 3.
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ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 31/03/2011 III.4. Functional characteristics Global Frequency band 2400 - 2483.5 MHz Channel spacing 5 MHz Channel number 16 Channel 11 (2405MHz)  Channel 26 (2480MHz) Technology DSSS Modulation O-QPSK with half sine pulse shaping Radio bit rate 250 kbps Transmit chip rate 2 Mchip/s Transmission ZE51 Min. Typ.
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ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 31/03/2011 [6], [7]) 5% 15% Min. Typ. Max.
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ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 31/03/2011 Min. Typ. Max.
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ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 31/03/2011 III.5. Digital Characteristics Microcontroller 8051 core Microcontroller Memory 256KB Flash, 8KB SRAM, Peripheral memory 8 KB EEPROM Serial link* Managed by application.  Full Duplex, from 1200 to 115200 bps  7 or 8 bits, with or without parity, 1 or 2 stop bits  Protocol Type : RS-232, TTL level Flow control* Managed by application.
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ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 31/03/2011 III.6. Absolute Maximum Ratings ZE51 -0.3V to +3.9V Voltage applied to VDD Voltage applied to any digital pin -0.3V to VDD+0.3V, max 3.9 V 10 dBm Input RF level ZE61 -0.3V to +3.6V Voltage applied to VDD Voltage applied to any digital pin -0.3V to VDD+0.3V, max 3.6 V 10 dBm Input RF level CAUTION It must be noted that due to some components, ZE51/ZE61 module is an ESD sensitive device.
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ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 31/03/2011 III.7. Ordering information The following equipments can be ordered: The SMD version The DIP interface version The USB dongle The Demo Case The versions below are considered standard and should be readily available. For other versions, please contact Telit. Please make sure to give the complete part number when ordering. Equipment and Part Number SMD Version ZE51/61-2.4/SMD-IA (With Integrated Antenna) ZE51/61-2.
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ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 31/03/2011 CHAPTER IV. TECHNICAL DESCRIPTION IV.1. Pin-out of the SMD Module Reproduction forbidden without Telit Communications S.p.A.
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ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.
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ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 31/03/2011 IV.2. Pin-out of the DIP Module Reproduction forbidden without Telit Communications S.p.A.
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ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 31/03/2011 IV.3. Correspondence Pin-Out correspondence between ZE51/61-2.4/DIP, ZE51/61-2.4/SMD and CC2530 SOC. ZE51/61-2.4/DIP Pin-out Pin n° J1 J1 J1 J1 J1 J1 J1 J1 J1 J1 J2 J2 J2 J2 J2 J2 J2 J2 J2 J2 ZE51/61-2.
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ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 31/03/2011 IV.4. Description of the Signals Signals Description Reset External hardware reset of the radio module. Active on low state. TXD, RXD Serial link signals, format NRZ/TTL: TXD is for outgoing data. RXD is for incoming data. The ‘1’ is represented by a high state. CTS Incoming signal. Indicates whether the module can send serial data to user (Active, on low state) or not (inactive, on high state). RTS Outgoing signal.
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ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 31/03/2011 CHAPTER V. PROCESS INFORMATION V.1. Delivery ZE51/61-2.4/SMD modules are delivered in plastic tray packaging, each tray including 50 units. The dimensions of the tray are the following: 329 mm x 176 mm x 5.6 mm. Each unit is placed in a 26.6 mm x 16 mm location. An empty tray weights 45 g and a loaded tray weights around 130 g. Reproduction forbidden without Telit Communications S.p.A.
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ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 31/03/2011 V.2. Storage The optimal storage environment for ZE51/61-2.4/SMD modules should be dust free, dry and the temperature should be included between -40°C and +85°C. In case of a reflow soldering process, tiny radio modules must be submitted to a drying bake at +60°C during 24 hours. The drying bake must be used prior to the reflow soldering process in order to prevent a popcorn effect.
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ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 31/03/2011 The recommended soldering pad layout on the host board for the ZE51/61-2.4/SMD-IA, is shown in the diagram below: All dimensions in mm Neither via-holes nor wires are allowed on the PCB upper layer in area occupied by the module. Reproduction forbidden without Telit Communications S.p.A.
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ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 31/03/2011 V.4. Solder paste composition (RoHS process) ZE51/61-2.4/SMD module is designed for surface mounting using half-moon solder joints (see diagram below). For proper module assembly, solder paste must be printed on the target surface of the host board. The solder paste should be eutectic and made of 95.5% of SN, 4% of Ag and 0.5% of Cu. The recommended solder paste height is 180 μm .
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ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 31/03/2011 V.6. Soldering profile (RoHS process) It must be noted that ZE51/61-2.4/SMD module should not be allowed to be hanging upside down during the reflow operation. This means that the module has to be assembled on the side of the printed circuit board that is soldered last. The recommendation for lead-free solder reflow in IPC/JEDEC J-STD-020D Standard should be followed. Reproduction forbidden without Telit Communications S.p.A.
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ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 31/03/2011 The barcode label located on the module shield is able to withstand the reflow temperature. CAUTION It must also be noted that if the host board is submitted to a wave soldering after the reflow operation, a solder mask must be used in order to protect the tiny radio module’s metal shield from being in contact with the solder wave. Reproduction forbidden without Telit Communications S.p.A.
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ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 31/03/2011 CHAPTER VI. BOARD MOUNTING RECOMMENDATION VI.1. Electrical environment The best performances of the ZE51/61-2.4 module are obtained in a “clean noise” environment. Some basic recommendations must be followed:  Noisy electronic components (serial RS232, DC-DC Converter, Display, Ram, bus ,...) must be placed as far as possible from the ZE51/61-2.4 module.
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ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 31/03/2011 VI.2. Power supply decoupling on ZE51/61-2.4 module The power supply of ZE51/61-2.4 module must be nearby decoupled. A LC filter must be placed as close as possible to the radio module power supply pin, VDD . Power Supply Symbols L1 C1 C2 L1 Vdd C1 C2 Reference LQH31MN1R0K03 GRM31CF51A226ZE01 Ceramic CMS 25V Value 1µH 22µF 100nF Reproduction forbidden without Telit Communications S.p.A.
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ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 31/03/2011 VI.3. RF layout considerations Basic recommendations must be followed to achieve a good RF layout :  It is recommended to fill all unused PCB area around the module with ground plane, except in case of integrated antenna (no ground plane must be placed in front of the antenna and on the bottom side).  The radio module ground pin must be connected to solid ground plane.
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ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 31/03/2011 VI.4. Antenna connection on Printed Circuit Boards Special care must be taken when connecting an antenna or a connector to the module. The RF output impedance is 50 ohms, so the strip between the pad and the antenna or connector must be 50 ohms following the tables below. Ground lines should be connected to the ground plane with as many vias as possible, but not too close to the signal line.
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ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 31/03/2011 VI.5. ZE51/61-2.4 interfacing : Example of a full RS-232 connection between a PC or an Automat (PLC) and ZE51/61-2.4/SMD-WA Reproduction forbidden without Telit Communications S.p.A.
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ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 31/03/2011 Example of a minimum PC connection with ZE51/61-2.4/SMD-IA . Reproduction forbidden without Telit Communications S.p.A.
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ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 31/03/2011 Example for sensor connection with ZE51/61-2.4/SMD-IA. Reproduction forbidden without Telit Communications S.p.A.
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ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 31/03/2011 CHAPTER VII. ANTENNA CONSIDERATIONS VII.1. Antenna recommendations ZE51/61-2.4 performances when used in a product are strongly dependent on the antenna type and its location. Particular cautions are required on the following points:  Use a good and efficient antenna designed for the 2.4 GHz band.  Antenna must be fixed in such a location that electronic noise cannot affect the performances. (Outside location is ideal if available).
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ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 31/03/2011 VII.2. Antenna matching Impedance matching can be required to deliver the maximum possible power from the module to the antenna and vice versa. This is typically accomplished by inserting a matching network into a circuit between the source and the load. This matching network must be established as close as possible to the ZE51/61 module. Here after an example of matching network between a ZE51/61-2.4 module and an antenna.
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ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 31/03/2011 VII.3. Antenna types The following are the antenna examples that may be suitable for ZE51/61-2.4/SMD-WA applications. We distinguish two types of antenna:   External antenna (antenna is mounted outside of the device) Embeddable antenna (antenna is integrated inside the device) VII.4. External antenna External antenna is recommended when the range performance is primordial.
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ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 31/03/2011 Half Wave Dipole antenna: The ½ Wave Dipole antenna is around 6 cm long. In a ½ Wave Dipole antenna the metallic plane is replaced by a second ¼ Wave antenna balancing the radiation. Half wave monopole antenna typically offers a ground-independent design with favorable gain, excellent radiation pattern. It has a high impedance and requires an impedance-matching circuit (See paragraph IX.
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ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 31/03/2011 VII.5. Embeddable antennas In this section you will find antennas designed to be directly attached to ZE51/61-2.4/SMD-WA module, inside the product casing. These antennas are only used in application where security, cosmetics, size or environmental issues make an external antenna impractical. This type of antenna is used when the integration factor becomes primordial (for mobile and handheld devices) to the range performances.
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ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 31/03/2011 ZE51/61-2.4/SMD-IA: Integrated antenna: ZE51/61-2.4 module is available with an integrated chip antenna, allowing very compact integration for small space application. Radiation Pattern of ZE51-2.4/DIP board It is very important to avoid ground plane around and below the antenna, so ZE51/61-2.4/SMD-IA must be implemented as described in paragraph VI.3 and schematics VI.5. Reproduction forbidden without Telit Communications S.p.A.
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ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 31/03/2011 CHAPTER VIII. ANNEXES VIII.1. Declaration of Conformity Reproduction forbidden without Telit Communications S.p.A.
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ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 31/03/2011 Reproduction forbidden without Telit Communications S.p.A.
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ZE51/61-2.4 RF Module User Guide 1VV0300868 Rev.4 – 31/03/2011 VIII.2. Conformity Assessment Issues FCC/IC Modules ZE51/61 are FCC/IC approved as modules to be installed in other devices. If the final product after integration is intended for portable use, a new application and FCC/IC is required. FCC Notice The FCC notifies users that any changes or modifications made to this device that are not expressly approved by Telit Communications S.P.A. may void the user’s authority to operate the equipment.
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ZE51/61-2.4 RF module User Guide 1VV0300868 Rev.4 – 31/03/2011 Wireless notice This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.