Hardware Manual
Table Of Contents
- WE865-DUAL Hardware User Guide
- Contents
- 1 Overview
- 2 Mechanical description
- 3 Pin-out
- 4 Electrical description
- 5 Thermal design guidelines
- 6 PCB layout design guidelines
- 7 Antenna
- 8 Integration with the GE863-PRO3
- 9 WE865-DUAL - Evaluation kit
- 10 Mounting the WE865-DUAL on the application board
- 11 Moisture sensitivity
- 12 Conformity assessment issues
- 13 Safety recommendations
- 14 Document change log
WE865-DUAL HW User Guide
1vv0300787 Rev. 1 - 03/10/08
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 44 of 48
Profile Feature
Pb-Free
Assembly
Average ramp-up rate (TL to TP)
3 °C / second
max
Preheat:
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
150 °C
200 °C
60-180
seconds
Tsmax to TL:
- Ramp-up rate
3 °C / second
max
Time maintaned above:
- Temperature (TL)
- Time (tL)
217 °C
60-150
seconds
Peak Temperature (Tp): 245 + 0/-5 °C
Time within 5 °C of actual Peak
Temperature (tp)
10-30 seconds
Ramp-down rate
6 °C/second
max
Time 25 °C to Peak Temperature 8 minutes max
Table 18
NOTE: All temperatures refer to topside of the package, measured on the package body surface.
IMPORTANT: WE865-DUAL module can accept only one reflow process