Hardware Manual
Table Of Contents
- WE865-DUAL Hardware User Guide
- Contents
- 1 Overview
- 2 Mechanical description
- 3 Pin-out
- 4 Electrical description
- 5 Thermal design guidelines
- 6 PCB layout design guidelines
- 7 Antenna
- 8 Integration with the GE863-PRO3
- 9 WE865-DUAL - Evaluation kit
- 10 Mounting the WE865-DUAL on the application board
- 11 Moisture sensitivity
- 12 Conformity assessment issues
- 13 Safety recommendations
- 14 Document change log
WE865-DUAL HW User Guide
1vv0300787 Rev. 1 - 03/10/08
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 43 of 48
10.3 Solder paste
Lead free
Solder paste
Sn / Ag / Cu
Table 17
10.4 Solder reflow
The following is the recommended solder reflow profile
Figure 22