Hardware Manual
Table Of Contents
- WE865-DUAL Hardware User Guide
- Contents
- 1 Overview
- 2 Mechanical description
- 3 Pin-out
- 4 Electrical description
- 5 Thermal design guidelines
- 6 PCB layout design guidelines
- 7 Antenna
- 8 Integration with the GE863-PRO3
- 9 WE865-DUAL - Evaluation kit
- 10 Mounting the WE865-DUAL on the application board
- 11 Moisture sensitivity
- 12 Conformity assessment issues
- 13 Safety recommendations
- 14 Document change log
WE865-DUAL HW User Guide
1vv0300787 Rev. 1 - 03/10/08
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 42 of 48
Figure 21
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish Layer tickness [um] Properties
Electro-less Ni /
Immersion Au
3-7 /
0,05-0,15
good solder ability protection,
high shear force values
Table 16
The PCB must be able to resist the higher temperatures, which are occurring at the lead-free process.
This issue should be discussed with the PCB-supplier. Generally, the wet-ability of tin-lead solder
paste on the described surface plating is better compared to lead-free solder paste.